Text

17877-0001-100, Rev. 1, CR-3 Inadequate Core Cooling Mitigation System Reliability Assessment, Task 1, Page 1 of 250 Through Page 80 of 250
	ML12314A392
Person / Time
Site:	Crystal River
Issue date:	10/31/2012
From:	Sarmanian L; Curtiss-Wright Flow Control Corp, SCIENTECH
To:	; Office of Nuclear Reactor Regulation
References
	3F1112-02, TAC ME6527 17877-0001-100, Rev. 1
	Download: ML12314A392 (80)
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Proj. No: 17877 JFC1roi CR-3 ICCMS RAM 17877-0001-100

.W"r*" Task I - ICCMS 100% Reliability Assessment Page 1 of 250 Revision 1 CR-3 Inadequate Core Cooling Mitigation System Reliability Assessment, Task I Document Number - 17877-0001 -100 Scientech, Project 17877 Revision I October 2012 Prepared By:

LGH S manian Reviewed By:

M.

H i

Reviewed By:

u. C. Rees Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 2 of 250 Revision 1 THIS PAGE IS INTENTIONALLY BLANK Task 1 - Reliability Assessment for CR-3 ICCMS

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WTH H Task 1 -

CR-3 ICCMS RAM ICCMS 100% Reliability Assessment 17877-0001-100 Page 3 of 250 Revision 1 Table of Contents 0.0 EXECUTIVE SUM MA RY .................................................................................. 4 1.0 INTRO DUCTIO N.............................................................................................. 5 2.0 INTENDED USE OF ANALYSIS RESULTS ..................................................... 6 3.0 TECHNICA L A PPROA CH ............................................................................... 7 3.1 Availability and Reliability Assessment Methodology .................................... 7 3.2 Model Developm ent and Q uantification ......................................................... 9 3.2.1 System and Top Events ...................................................................................................... 9 3.2.2 Success Criteria ...................................................................................................................... 10 3.2.3 System Module Data and Databases ................................................................................ 10 3.2.4 Logic Model Development .................................................................................................. 19 3.2.5 Quantification ......................................................................................................................... 24 4.0 APPLICABLE SCIENTECH QAM/SOPS ...................................................... 27 5.0 A SSUM PTIO NS ............................................................................................ 28 6.0 RESULTS ............................................................................................................ 30 6.2 Availability Results ....................................................................................... 32 6.3 Reliability Results ........................................................................................ 34 7.0 CO NCLUSIO NS .............................................................................................. 39

8.0 REFERENCES

................................................................................................. 40 A ppendix A ICCM S Block Diagram ....................................................................... 42 A ppendix B ICCM S Module Data ......................................................................... 49 A ppendix C ICCM S Module Logic ....................................................................... 81 A ppendix D Cutsets ................................................................................................ 127 A ppendix E Im portance .......................................................................................... 222 Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 S,,1FNTF(Jf Task 1 - ICCMS 100% Reliability Assessment Page 4 of 250 Revision 1 0.0 EXECUTIVE

SUMMARY

Progress Energy established desired availability/reliability goals of 0.999 over a 184 day period for 4 specified ICCMS functions, based on performing train surveillance testing every six months. The reliability analysis was performed in accordance with IEEE Standard 352-1987, "IEEE Guide for General Principles of Reliability Analysis of Nuclear Power Generating Station Safety Systems," and IEEE Standard 577-2004, "IEEE Standard Requirements for Reliability Analysis in the Design and Operation of Safety Systems for Nuclear Facilities". This analysis used the calculation model from MIL-HDBK-217F "Military Handbook Reliability Prediction of Electronic Equipment."

This analysis did not consider software failure, because the ICCMS is an analog system; it does not rely on software to perform any safety related function. The analysis did consider individual component failures. The availability analysis calculates an availability for each of the four evaluated ICCMS functions ranging from .99999371 to .99999919, using an estimated mean time to repair of 12 hours1.388889e-4 days 0.00333 hours 1.984127e-5 weeks 4.566e-6 months . This easily exceeds the .999 requirement. The reliability analysis calculates an availability for each of the four evaluated ICCMS functions ranging from

.99925529 to .99989786, using the 184 day period. This exceeds the .999 reliability goal for 184 days, and, therefore, meets the requirements of IEEE 603 Clause 5.15.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task 1 - ICCMS 100% Reliability Assessment Page 5 of 250 Revision 1

1.0 INTRODUCTION

An extended power uprate (EPU) is being implemented for Progress Energy's Crystal River Unit 3 Nuclear Station (CR-3). As a component to the EPU, Progress Energy has initiated a project to design and install a new Inadequate Core Cooling Mitigation System (ICCMS). The ICCMS shall be utilized to perform three Loss of Coolant Accident (LOCA) mitigation actuations.

Additionally, the ICCMS will provide selected Reg. Guide 1.97 Post Accident Monitoring Instruments.

The three LOCA mitigation actuations are: 1) automatic tripping of the RCPs within one minute of a reactor trip with a loss of sub cooling margin (LOSCM) in the Reactor Coolant System (RCS); 2) automatic raising of the SG level control to the ISCM set point within 20 minutes of a reactor trip and LOSCM in the RCS; and 3) automatic actuation of the Fast Cooldown System (FCS), which shall actuate the Atmospheric Dump Valves (ADVs) in Fast Cooldown mode.

Actuation of the ADVs will occur within 10 minutes of a reactor trip and LOSCM, coupled with an inadequate High Pressure Injection (HPI) flow as measured by the ICCMS.

The three Reg. Guide 1.97 Accident Monitoring indications are 1) subcooling margin; 2) superheat; and 3) HPI flow margin.

The overall project includes a reliability program which includes the Reliability, Availability, and Maintainability (RAM) analyses consisting of Task 1: Reliability Assessment, Task 2: Failure Modes and Effects Analysis, and Task 3: Manufacturer's Data Collection. The purpose of this report is to document the Reliability Assessment performed for Task 1 at the 100% design phase.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 V ,NTIC,, Task I - ICCMS 100% Reliability Assessment Page 6 of 250 Revision 1 2.0 INTENDED USE OF ANALYSIS RESULTS As part of the CR-3 ICCMS Risk and Reliability effort, the Reliability Analysis is performed at two stages in the design, corresponding to the 60% design and the 100% final design and was performed following the guidance provided in ANS/IEEE Std. 352-1987 [1]. The goals of the analysis are to:

" Demonstrate that the system meets the desired availability value

" Demonstrate that the system meets the desired reliability value

" Determine the reliability of the system with a testing interval of 184 days Additionally, the modeling methods utilized confirm that the ICCMS meets the single failure requirement.

This analysis was performed according to the guidelines established in the CR-3 ICCMS RAM Project Plan [2], Task Plan 1 [3], and Scientech Quality Assurance Manual [4].

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 7 of 250 Revision 1 3.0 TECHNICAL APPROACH 3.1 Availability and ReliabilityAssessment Methodology The methodology employed is based upon and consistent with IEEE 603 and IEEE 352. An overview of the RAM Methodology is shown in Figure 1. Each of the activities in the Reliability Approach is discussed below (note that the number of each activity is also shown in the figure).

FIGURE 1 Overview of RAM Approach For CR -3 ICCMS A Symbol Refers to Activity "N" Described in Section 2.2

1) The modules that form the system for RAM Analysis are defined as described in the system block diagram [5].

Task 1 - Reliability Assessment for CR-3 ICCMS

OR-3 lOOMS RProj. RAM 17877-0001-100 No: 17877 Task 1 - ICCMS 100% Reliability Assessment Page 8 of 250 Revision 1

2) The Mean Time Between Failures (MTBF) / Mean Time To Repair (MTTR) information is documented for each system element; this information is to be provided by the component suppliers / OEMs. If this information is not available from the component suppliers / OEMs then it will be obtained from similar components or generic sources [1].

3) Each manufacturer providing parts for the system was requested to provide the reliability information on their supplied parts. The best available data for MTBF and MTTRs was used. Generic data is documented in the Task 1 30% Report [6] and the Task 3 Report

[7].

4) The system module list was iteratively updated in conjunction with the maturation and refinement of the system design and selection of parts vendors. There are submittals of this to CR-3 at the 60% and 100% Design Approval stage.

5) CR-3 has provided the Mean Logistical Delay Times, MLDT 1 , the expected delay time from fault identification to initiating maintenance is 4 hours4.62963e-5 days 0.00111 hours 6.613757e-6 weeks 1.522e-6 months and the expected delay time from the time that repair has been completed until the channel/train is restored to service is 2 hours2.314815e-5 days 5.555556e-4 hours 3.306878e-6 weeks 7.61e-7 months . For all Availability calculations, Scientech used the provided MLDT values for all Network Elements.

6) The combination of the MTBF, MTTR, and MLDT values make up the Reliability Data Base. This data is maintained in an Excel table with version control.

7) The System Availability is calculated using the following method:

Compute the availability of each network element by dividing the MTBF by the sum of MTBF, MTTR, and MLDT. For the ith network element:

MTBFi AVAILABILITYi =-

MTBFi + MTTRi + MLDTi

8) The System Reliability will be calculated using the following method:

Compute the Reliability of any single module by applying the exponential function to the negative of the quotient that results when the mission duration is divided by the MTBF for that network element. For the ith network element:

RELIABILITY1 = e-t Where X= 1/MTBF and t = Mission Duration The Mission Duration is the period of time during from when the system is "started" until the system is tested and verified as operable. When testing verifies that the system is Procurement specification Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877

.................. 17877-0001-100 Task 1 - ICCMS 100% Reliability Assessment Page 9 of 250 Revision 1 operable the exposure time of the system is reset. For example, if the system is only tested during refueling outages it is verified as operable at that interval and the time clock is reset. In this study the test interval has been defined as 184 days the CR-3.

9) Using the Module Design Single-Line Functional Block Wiring and System-Level Diagram (a 30% Design deliverable), Failure Modes and Effect Analysis [8], (FMEAs),

were conducted by the Scientech design and reliability team at the 60% design stage and updated at the 100% design stage. The FMEAs were conducted in accordance with IEEE 352 (See R&R TP2-17877).

10) For the entire system, a reliability and availability (end to end) estimate is calculated using the Reliability Database and the module reliability and availability values generated in Activities 7 and 8.

11) During the evaluation of the system reliability and availability, there has been considerable dialog between the system design team and reliability team in order to assure that the Reliability and Availability requirements are met. This activity reflects that those interactions may result in design modifications.

12)The required quantities of reliability replacements (spares) will be calculated in accordance with the contract specification and additional clarification received from CR-

3. This will be performed at the 60% and 100% Designs.

3.2 Model Development and Quantification The following Sections describe the development of the availability and reliability models for the ICCMS, its quantification, and the results obtained.

3.2.1 System and Top Events A block diagram of the ICCMS is presented in Appendix A. The block diagram is developed from NUS-A304DB, Rev. 3. Appendix A consists of 6 sheets. The first three sheets correspond to Trip Chanel Cabinets 1 through 3. Sheets 4 through 6 contain the Train A and Train B trip logic, which are physically located within cabinets 1 and 2. The MCB Display functions are shown in the first 2 sheets with the components located on the MCB indicated with shading.

The ICCMS was evaluated for the following four system functions:

Fast Cooldown System Initiation (FCS INIT)

Emergency Feedwater Initiation and Control (EFIC) Inadequate Subcooling Margin (ISCM) Setpoint

Reactor Coolant Pump Trip

MCB Reg. Guide 1.97 Display Functions Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 10 of 250 Revision 1 3.2.2 Success Criteria The success criteria defined for the four functions being evaluated are as follows:

" FCS Initiation - The success of either Trip Train A or Trip Train B to provide a signal to MSV-25 and MSV-26 such that both MSV-25 and MSV-26 receive a signal.

" EFIC ISCM Setpoint - The success of either Trip Train A or Trip Train B to provide the EFIC ISCM Level Trip signal.

Reactor Coolant Pump Trip - The success of either Trip Train A or Trip Train B to provide a trip signal such that each of the four reactor coolant pumps receives a trip signal.

MCB Reg. Guide 1.97 Display Functions - The success of either the Channel 1 or Channel 2 displays for each of the indicated functions.

3.2.3 System Module Data and Databases Two separate databases were developed for use in this project; the first is the Availability Database and the second is the Reliability Database. The Availability Database is used to evaluate the system logic to determine the availability of the system. The availability data (WinNUPRA files AV-ICCMS.BED) is calculated as:

MTBFi AVAILABILITYi =------------------------------

MTBFi + MTTRi + MLDTI The reliability data (WinNUPRA files RL-ICCMS.BED) is calculated as:

FAILURE RATEi = 1 / MTBFI RELIABILITYi = 1 - FAILURE RATEi Appendix B presents the data development for the standard modules. For each module, the parts list was converted to a worksheet in EXCEL. For each component the item number, part number, description, component manufacturer, the component count for the given module, the MTBF, and failure rate are also shown. The last column calculates the contribution by component to module failure. The contributions are summed to develop the failure rate for the module. Comments are presented in the last column. The first failure rate is for the module only and this value is used in the reliability analysis.

Some of the parts manufacturers do not track or maintain availability/reliability data for the parts that they manufacture. For these components generic data was used. A review of the generic data used in this analysis was performed to ensure the suitability of the date for this application.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877o 001-100 Task 1 - ICCMS 100% Reliability Assessment Page 11 of 250 Revision 1 The table presented below contains the components in the model that utilize generic data. The last column in the table describes the data source used.

Table of Components Utilizing Generic Data Component MTBF Part No. Description Manufacturer (hours) Assumptions Wire, 600V, Insulated WIRE, INSULATED, 600V N/A 1.OOE+08 Generic data from Table 7-3, MIL-OR GREATER, RYPE B OR C, HDBK-217F SIZE AND COLOR AS REQUIRED Wire, 22AWG, BARE Jumper, OOhm N/A 1.00E+08 Generic data from Table 7-3, MIL-HDBK-217F 3683S-1-105L Precision Potentiometer, Bourns, Riverside, 8.76E+10 The CA manager stated component Value Display, 3 Digit, CA is sustainable for 20 million 1Meg revolutions, considering component will rotate at 2 cycles per year, calculated MTBF as 8.76E10 hours.

6638S-1-103 Precision Potentiometer, Bourns, Riverside, 8.76E+10 The QA manager stated component lOKOhm, 1W Single Turn CA is sustainable for 20 million revolutions, considering component will rotate at 2 cycles per year, calculated MTBF as 8.76E10 hours.

50058-8000 Crimp Terminal, Female Molex Inc., Lisle, IL 7.69E+08 MTBF based off of component 3111-000(VME) from the PDF document titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

50058-8100 Crimp Terminal, Female Molex Inc., Lisle, IL 7.69E+08 MTBF based off of component 3111-000(VME) from the PDF document titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-iOO-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

51021-0300 Connector, Female, 3 POS, Molex Inc., Lisle, IL 7.69E+08 MTBF based off of component 3111-2.54MM 000(VME) from the PDF document titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877 001-100 Task 1 - ICCMS 100% Reliability Assessment Page 12 of 250 Revision 1 Table of Components Utilizing Generic Data Component MTBF Part No. Description Manufacturer (hours) Assumptions 51021-0500 Connector, Female, 5 POS, Molex Inc., Lisle, IL 7.69E+08 MTBF based off of component 3111-1.25 mm 000(VME) from the PDF document titled 'Connectors.pdf This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

51021-1000 Connector, Female 10 Molex Inc., Lisle, IL 7.69E+08 MTBF based off of component 3111-POS, 1.25MM OO0(VME) from the PDF document titled 'Connectors.pdf This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

53047-0210 Connector, Male 2 POS, Molex Inc., Lisle, IL 7.69E+08 MTBF based off of component 3111-1.25MM, Vertical Thru- 000(VME) from the PDF document Hole titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

53047-03 Connector, Male 3 POS, Molex Inc., Lisle, IL 7.69E+08 MTBF based off of component 3111-2.54MM, Vertical Thru- O00(VME) from the PDF document Hole titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

53047-0310 Connector Header 3POS Molex Inc., Lisle, IL 7.69E+08 MTBF based off of component 3111-1.25MM Vertical TIN 000(VME) from the PDF document titled 'Connectors.pdf This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

53047-0510 Connector, Male, 10 POS, Molex Inc., Lisle, IL 7.69E+08 MTBF based off of component 3111-1.25mm, Vertical Thru 000(VME) from the PDF document Hole titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-lOO-240AC/24DC/1.3 Technical Task 1 - Reliability Assessment for CR-3 ICCMS

5* CR-3 ICCMS RAM Proj. No: 17877 178770001-100 Task 1 - ICCMS 100% Reliability Assessment Page 13 of 250 Revision 1 Table of Components Utilizing Generic Data Component MTBF Part No. Description Manufacturer (hours) Assumptions Specification Sheet, Phoenix Contact.

90120-0122 Connector Header 2POS Molex Inc., Lisle, IL 7.69E+08 MTBF based off of component 3111-0.100" STR TIN 000(VME) from the PDF document titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

42819-2212 Connector, Header, Molex Inc., Lisle, IL 7.69E+08 MTBF based off of component 3111-10mm, Vertical, Male, 2 000(VME) from the PDF document pos titled 'Connectors.pdf This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

53047-10 Connector, Male 10 POS, Molex Inc., Lisle, IL 7.69E+08 MTBF based off of component 3111-1.25mm, vertical Thru- 000(VME) from the PDF document hole titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

EJH-125-01-S-D-SM-LC Connector, Header, 0.1", Samtec, New 7.69E+08 MTBF based off of component 3111-Vertical, Male, SMT, Albany, IN 000(VME) from the PDF document Locking Clip, 50 pos titled 'Connectors.pdf This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

EJH-125-01-F-D-SM-LC Connector, Header, 0.05", Samtec, New 7.69E+08 MTBF based off of component 3111-Vertical, Male, SMT, Albany, IN 000(VME) from the PDF document Locking Clip, 50 pos titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

Task 1 - Reliability Assessment for CR-3 ICCMS

CR-3 ICCMS RAM Proj. No: 17877 18700-0 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 14 of 250 Revision 1 Table of Components Utilizing Generic Data Part No. Description Component MTBF Manufacturer (hours) Assumptions EJH-113-01-F-D-SM-LC Connector, Header, 0.05", Samtec, New 7.69E+08 MTBF based off of component 3111-Vertical, Male, SMT, Albany, IN 000(VME) from the PDF document Locking Clip, 26 pos titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

CGA6P3X7R1H335K Capacitor, Ceramic, 3.3uF, TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from 50V, X7R, 10%, 1210 SMD AVX Corp.

FK207R1H1O5K Capacitor, Ceramic, 10%, TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from luF, 25V MIN AVX Corp.

FK2OX7RlHlO5K Capacitor, Ceramic, 10%, TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from luF, SOV AVX Corp.

FK22COG1H224J Capacitor, Ceramic, 10%, TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from 0.22uF, 25V MIN AVX Corp.

FK22X7RIE1O5K Capacitor, Ceramic, 10%, TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from luF, 50V AVX Corp.

FK22X7RtE1O6K Capacitor, Ceramic, 10%, TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from lOuF, 25V AVX Corp.

FK22X7R1H225K Capacitor, Ceramic, 10%, TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from 2.2uF, X7R, 25V AVX Corp.

FK22X7R1H335K Capacitor, Ceramic, 10%, TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from 3.3 uF, X7R, 50V AVX Corp.

FK22Y5V1E226Z Capacitor, Ceramic, 20%, TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from 22uF, 25V AVX Corp.

FK24COG1H224J Capacitor, Ceramic, 10%, TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from 0.22uF, 50V AVX Corp.

FK24X7R1E1O5K Capacitor, Ceramic, 10%, 1 TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from uF, X7R, 50V AVX Corp.

FK28X7R1H1O3K Capacitor, Ceramic, 10%, TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from O.OluF, 25V MIN AVX Corp.

FK28X7R1HlO4K Capacitor, Ceramic, 10%, TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from O.luF, X7R, 50V AVX Corp.

FK28X7R1H682K Capacitor, Ceramic, 10%, TDK, Uniondale, NY 3.52E+10 Based on similar capacitors from 6.8uF, 50V AVX Corp.

536385-5 Connector, DIN 41612 M TE Connectivily, 7.69E+08 MTBF based off of component 3111-64 POS 2.54 mm Solder Belwyn, PA O00(VME) from the PDF document Right Angle Thru Hole I I titled 'Connectors.pdf' This was too Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 RAM M 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 15 of 250 Revision 1 Table of Components Utilizing Generic Data Part No. Description Component MTBF Manufacturer (hours) Assumptions conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

3-1437667-1 Connector, Barrier Strip, 8 TE Connectivily, 7.69E+08 MTBF based off of component 3111-Pos, 0.325 Spacing, PTH Belwyn, PA 000(VME) from the PDF document titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

3-1437667-4 Connector, Barrier Strip, 2 TE Connectivily, 7.69E+08 MTBF based off of component 3111-Pos, 0.325 Spacing, PTH Belwyn, PA 000(VME) from the PDF document titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

3-1437667-3 Connector, Barrier Strip, TE Connectivily, 7.69E+08 MTBF based off of component 3111-10 Pos, 0.325 Spacing, PTH Belwyn, PA 000(VME) from the PDF document titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

5650859-5 Connector, DIN41612 Type TE Connectivily, 7.69E+08 MTBF based off of component 3111-B, Vertical, Femal, 64 pos Belwyn, PA 000(VME) from the PDF document titled 'Connectors.pdf This was too conservative. Used MTBF of 769230769, Task 130% Report, Reference 7 (MINI-PS-iOO-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

8-1293640-5 Connector, DIN41612 Type TE Connectivily, 7.69E+08 MTBF based off of component 3111-c/2, Vertical, Femal, 48 pos Belwyn, PA 000(VME) from the PDF document titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 130% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task 1 - ICCMS 100% Reliability Assessment Page 16 of 250 Revision 1 Table of Components Utilizing Generic Data Component MTBF Part No. Description Manufacturer (hours) Assumptions 492739-1 Connector, Lightray, TE Connectivily, 7.69E+08 MTBF based off of component 3111-Backplane Housing - Belwyn, PA OOO(VME) from the PDF document Simplex titled 'Connectors.pdf This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

492740-2 Retention Clip, Lightray, TE Connectivily, N/A Values based off of Vishay Resistors for Backplane Housing Belwyn, PA 492234-1 Connector, Lightray, TE Connectivily, 7.69E+08 MTBF based off of component 3111-System Card Houseing - Belwyn, PA 000(VME) from the PDF document Simplex titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

1676174-2 Resistor, Metal Film, 0.1%, TE Connectivily, 1.09E+09 Values based off of Vishay Resistors 1/10W, 1OPPM, Belwyn, PA 12.7KOhms, 0805 1676673-2 Resistor, Thin Film, TE Connectivily, 1.09E+09 Values based off of Vishay Resistors 24.3kOhm, 1/10W, 0.1%, Belwyn, PA 1OPPM/C, 0805 SMD 1676674-3 Resistor, Thin Film, TE Connectivily, 1.09E+09 Values based off of Vishay Resistors 24.9kOhm, 1/10W, 0.1%, Belwyn, PA 1OPPM/C, 0805 SMD 526285-5 Connector, DIN 41612 M TE Connectivily, 7.69E+08 MTBF based off of component 3111-64 POS 2.54 mm, Solder Belwyn, PA 000(VME) from the PDF document Right Angle Thru-Hole titled 'Connectors.pdf' This was too conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

5650948-5 Connector, DIN 41612, TE Connectivily, 7.69E+08 MTBF based off of component 3111-TYPE C, 48 POS 2.54 mm, Belwyn, PA 000(VME) from the PDF document Solder Right Angle Thru- titled 'Connectors.pdf This was too Hole conservative. Used MTBF of 769230769, Task 1 30% Report, Reference 7 (MINI-PS-100-240AC/24DC/1.3 Technical Specification Sheet, Phoenix Contact.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task 1 - ICCMS 100% Reliability Assessment Page 17 of 250 Revision 1 Table of Components Utilizing Generic Data Part No. Description Component MTBF Manufacturer (hours) Assumptions RN73C2A14K7BTDF Thin Film Resistor 0.1W, TE Connectivily, 1.OOE+10 Values based off of Vishay Resistors 1% 1OPPM 14.7K Ohm, Belwyn, PA 0805, SMD CMD333UWC LED, White, T-1, 3/4 Chicago Miniature 1.00E+09 Generic data based on LED from Lighting, Osram Opto Semi Hackensack, NJ 534B1103JC Precision Potentiometer, Vishay Precision 8.76E+10 MTBF is pulled from similar 10K, 15 Turn, 0.25" Shaft Group, Malvern, PA component constructed at Bourns.

B516 Board, Adapter, TSSOP to Bellin 7.69E+08 Connector data from Molex Inc.,

DIP 16 PIN Lisle, IL MAZ30KO0OB Resistor, Metal Film, 0.1%, Alpha Electronics 6.43E+08 Based on similar resistors 1/8W, 1PPM, 30KOhm, Corp.

ThroughHole IN5239B Diode, Zener, 9.1V Central 4.38E+07 Based on Fairchild Zener Diode Semiconductor As can be seen in from the above, generic data was used when manufacturer data was not available. In almost all cases data from similar components produced by either the same or other manufacturers was utilized. In some cases the MTBF was calculated based on raw performance data as noted above. Review of the MTBF values shows that numerous connectors has an MTBF of 7.69E+8, the lowest value, resulting in lowest availability, in the table. Review of the model results demonstrates that this component does not contribute significantly to system unavailability or reliability.

An additional calculation was performed to develop data for the availability model. The MTTR and MLDT for the module are used to calculate the module availability. This is presented in the last 3 rows of each worksheet. The dominant contributors to the unavailability of each module are indicated by the associated row being shaded.

The following versions of the parts lists were used for the 100% RAM evaluation [9-24]:

NUS-A323PA, Rev. A Red-Line, Analog Input Module Parts List NUS-A324PA Rev. A Red-Line, Analog Output Module Parts List NUS-A325PA, Rev. 0, Contact Input Module Parts List NUS-A326PA, Rev. 0, Contact Output Module Parts List NUS-A327PA, Rev. A, Red-Line Functions Generator Module Parts List NUS-A328PA, Rev. A Red-Line, Power Supply Monitor Module Part List NUS-A329PA, Rev. A Red-Line, Alarm Module Parts List NUS-A330PA, Rev. 0, Reactor Trip Module Parts List NUS-A331 PA, Rev. A Red-Line, Summer Module NUS-A332PA, Rev. A Red-Line, Display Select Module Parts List NUS-A333PA, Rev. 0, HI Auctioneer Module Parts List NUS-A334PA, Rev. A Red-Line, Channel Trip Module Parts List Task 1 - Reliability Assessment for CR-3 ICCMS

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__ ý CR-3 ICCMS RAM Task 1 - ICCMS 100% Reliability Assessment 17877-0001-100 Page 18 of 250 Revision 1 NUS-A335PA, Rev. 0, Train Trip Module Parts List NUS-A339PA, Rev. A Red-Line, Difference Module NUS-A341 PA, Rev. 0, Filler Module Parts List NUS-C099PA, Rev. C, ICCMS Rack Backplane Parts List All modules were reviewed to identify components that do not contribute to module failure.

Components found not to contribute are identified in the tables presented in Appendix B in the last column. Modules with a high importance were additionally reviewed to identify specific components that do not contribute (e.g., if there are 7 resistors of a given specification in a module, how many of them do not impact the operation of the module).

The number of components found not to contribute is noted in the last column of the associated tables presented in Appendix B.

The resulting Availability and Failure Rate for each module is presented in the table below.

The spreadsheets used to calculate these values are presented in Appendix B.

Module ID Availability Failure Rate Alarm Module NUS-A329 0.999931 1.13E-05 Analog Input Module NUS-A323 0.999943 9.38E-06 Analog Output Module NUS-A324 0.999899 1.66E-05 HI Auctioneer Module NUS-A333 0.999972 4.66E-06 Backplane-1 NUS-C099 0.999993 1.01 E-06 Backplane-2 NUS-C099 0.999991 1.35E-06 Backplane-3 NUS-C099 0.999999 1.33E-07 Backplane-4 NUS-C099 0.999997 4.85E-07 Backplane-5 NUS-C099 0.999999 1.30E-07 Backplane-6 NUS-C099 0.999999 1.31 E-07 Contact Input Module NUS-A325 0.999972 4.59E-06 Contact Output Module NUS-A326 0.999978 3.57E-06 Channel Trip Module NUS-A334 0.999978 3.58E-06 Difference Module NUS-A339 0.999973 4.44E-06 Display Select Module NUS-A332 0.999925 1.23E-05 Function Generator Module NUS-A327 0.999882 1.93E-05 Filler Module NUS-A341 0.999999 1.68E-07 Power Supply Monitor Module NUS-A328 0.999939 1.OOE-05 Reactor Trip Module NUS-A330 0.999987 2.17E-06 Summer Module NUS-A331 0.999977 3.73E-06 Train Trip Module NUS-A335 0.999972 4.65E-06 The above module values are used in the Availability Database and the Reliability Database in addition to the few single components used in the ICCMS.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 19 of 250 Revision 1 3.2.4 Logic Model Development A common logic model was developed to evaluate both availability and reliability. The model was developed using fault tree methodology in the software package WinNUPRA [25]

which is subject to the Scientech QA requirements for safety related software. The fault tree model was evaluated using failure data corresponding to the availability data and the reliability data. Availability was then calculated by subtracting the failure rate from 1.0.

Fault trees were developed to represent the system logic. The same fault tree structure is used for both the availability and reliability calculations although the data used for these calculations differs. The fault trees were developed and solved in the software package WinNUPRA.

Appendix C presents the fault trees developed to represent the IC(CMS logic. Eight separate fault trees were developed. These fault trees are presented in Appendix C.

In WinNUPRA, the fault tree gate name for each gate in the logic corresponds to a specific fault tree file known as a .LGC file. Each page name is unique. The first character is always "G" for gate. The next set of characters (up to 3) are the Fault Tree ID. The next set of characters is the Page Name and can consist of 1 to 4 characters. Each page of a fault tree is layed out on a grid. The last 2 positions correspond to the row and column where the gate is located. For this model, the following gate and page names are used:

Portion of Logic Fault Tree Name Fault Tree ID Cabinet 1 Channel Logic CHANNELI.LGC C(-

Cabinet 2 Channel Logic CHANNEL2.LGC C2-Cabinet 3 Channel Logic CHANNEL3.LGC C3-Cabinet Power Supplies POWER.LGC PW-FCS Train Trip Logic FCS.LGC FCS EFIC ISCM Setpoint Logic EFIC-SET.LGC EF-RCP Train Trip Logic RCP-TRP.LGC TR-MCB Display Logic MCB-DISP.LGC M(CB The fault trees are described in three groups presented below.

3.2.4.1 Group 1: Trip Channel Logic 3 fault trees represent the 3 sets of channel logic contained in cabinets 1, 2, and 3 (CHANNEL1.LGC, CHANNEL2.LGC, and CHANNEL3.LGC). These fault trees are presented in Appendix C as Figures C-1, C-2, and C-3. Specific areas of the model are presented below. The character "x" is used to indicate channel 1, 2, or 3 as appropriate.

Each of the gates described below correspond to the signal at specific points in the system that are identified in the block diagram presented in Appendix A. For example:

Temperature In-core (Gate GCx-1240)

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM A 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 20 of 250 Revision 1 For the case where x indicates channel 1, this gate represents the logic to develop the signal shown coming out of IZ-01-08-14 (shown on the first page of the block diagram in Appendix A in the upper right of the figure) in a box with an angled right side containing the text "Tincore CH. 1").

Temperature In-core CH. x (Fault Tree CHANNELx.LGC, Gate GCx-1 240)

IZ-Ox-08-14 processes the inputs from 8 channels of in-core temperature instrumentation.

The temperature input is provided by eight channels, each with a single thermocouple (0°F to 2500'F) and temperature transmitter that send 4-20 mA signals. For the purposes of this study, these signals (provided by Incore TIC IM-5G-TE, IM-3L-TE, IM-6C-TE, IM-60-TE, IM-9H-TE, IM-9E-TE, IM-100-TE, and IM-13G-TE, shown in dashed boxes in the upper right edge of the first 3 pages of the block diagram presented in Appendix A) are defined as being outside of the established system boundaries and the first components within the system are the EMI/RFI filters that receive the signal. There are eight independent input channels to the ICCMS. Once the channels have processed the high temperature signals, the Hi Auctioneer Module determines which is the highest and passes the data along. Since the logic in IZ-Ox-08-14 selects the highest temperature, only 1 of the 8 signals passing into IZ-0X-08-14 is required for success (failure is defined as 8 of 8 inputs failed).

Rx Trip CH. x (Gate GCx-1 310)

When a reactor trip occurs there are four breaker combinations that are used to verify that the reactor has been tripped. The four combinations are as follows:

"A" and "B" OPEN

" "A" and "D1D2" OPEN

"B" and "C1C2" OPEN

"C0C2"and "DID2" OPEN As long as one of these combinations is True, then the signal is sent to the Reactor Trip Logic Module to send the signal (failure is defined as all 4 combinations fail). These combinations are explicitly modeled in the fault trees under gate(s) GCx-1 330.

HPIF REQ CH. 1 (Fault Tree CHANNELx.LGC, Gate GCx-1 110)

The system collects data from the RCS Wide Range Pressure or the RCS Low Range Pressure instrumentation to determine the required HPI flow using the HPI flow margin curve. The HPI flow margin curve is defined in provided AREVA calculation 51-9144830-000 "CR-3 EPU Required SBLOCA HPI Flow without FCS". For the purposes of this evaluation only the components within the ICCMS are evaluated. It is assumed that the pressure sensors and any upstream signal processing devices are operable. The system boundary extends to the EMI/RFI filters that receive the pressure signals.

An EMI/RFI filter and Analog Input Module receives signals from each of the 2 pressure sensors and process these signals prior to passing them on to the Alarm Module (IZ-Ox Task 1 - Reliability Assessment for CR-3 ICCMS

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12) to be processed. Once the delay time has been satisfied, the signal is then passed onto the Function Generator Logic Module (IZ-Ox-06-01).

TSAT(-err) (Fault Tree CHANNELx.LGC, Gate GCx-1 1A0)

TSAT(-err) is determined from pressure readings obtained from the RCS Wide Range Pressure and the RCS Low Range Pressure. The RCS Wide Range Pressure is acquired from a single 0-2500 psig instrument that provides a 4-2OmA signal, whereas the RCS Low Range Pressure is acquired from a single 0-600 psig instrument that provides a 4-2OmA signal.

An EMI/RFI filter and Analog Input Module receive signals for each of the 2 pressure sensors prior to passing them on to the Alarm Module (IZ-Ox-06-12) to be processed. The signal is passed onto the Function Generator Logic Module (IZ-Ox-06-03) to be processed for the LOSCM step.

TSAT(nom) (Fault Tree CHANNELx.LGC. Gate GCx-1 1A2)

TSAT(nom) is determined from pressure readings obtained from the RCS Wide Range Pressure and the RCS Low Range Pressure. The RCS Wide Range Pressure is acquired from a single 0-2500 psig instrument that provides a 4-2OmA signal, whereas the RCS Low Range Pressure is acquired from a single 0-600 psig instrument that provides a 4-2OmA signal.

An EMI/RFI filter and Analog Input Module receive signals for each of the 2 pressure sensors prior to passing them on to the Alarm Module (IZ-Ox-06-12) to be processed. The signal is passed onto the DSM2500 Module (IZ-Ox-05-07) to be processed for the MCB displays.

TSAT(+err) (Fault Tree CHANNELx.LGC. Gate GCx-1 1A4)

TSAT(+err) is determined from pressure readings obtained from the RCS Wide Range Pressure and the RCS Low Range Pressure. The RCS Wide Range Pressure is acquired from a single 0-2500 psig instrument that provides a 4-2OmA signal, whereas the RCS Low Range Pressure is acquired from a single 0-600 psig instrument that provides a 4-2OmA signal.

An EMI/RFI filter and Analog Input Module receives signals for each of the 2 pressure sensors prior to passing them on to the Alarm Module (IZ-Ox-06-12) to be processed. The signal is passed onto the DSM2500 Module (IZ-Ox-05-07) to be processed for the MCB displays.

HPIF CH. x (Fault Tree CHANNELx.LGC. Gate GCx-1050)

The HPI flow is calculated using instrumentation from four separate channels, each comprising of two EMI/RFI filters (IZ-Ox-FILy, where y is 1, 2, 3, or 4), an Analog Input Module (IZ-Ox-07-0y, where y is 1, 2, 3, or 4) and a Function Generator Module (IZ-Ox Task 1 - Reliability Assessment for CR-3 ICCMS

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CR-3 ICCMS RAM ICCMS 100% Reliability Assessment 17877-0001-100 18700-0 Page 22 of 250 Revision 1 Oz, where z is 6, 7, 8, or 9). Using the flow rates gathered, the system sums the individual readings to generate a flow value. This flow value is compared against the required HPI flow to determine if additional cooling is needed. The comparison is performed by IZ-Ox 13. For this step, it is assumed that the system will successfully provide the HPI Flow only if all four channels are operating.

LOSCM CH. x (Fault Tree CHANNELx.LGC. Gate GCx-1210)

The subcooling margin is calculated using the SCM curve and the instrumentation inputs from the RCS Wide Range Pressure, RCS Low Range Pressure, and the thermocouples.

The SCM curve is defined in CR3 calculations 184-0003, SPDS Description Document and 196-0002, SPDS TSAT Display Errors. The SCM curve is based on ASME 1967 steam tables plus instrument uncertainty.

Once the RX Trips, T1ncore and TSAT(-err) signals are forwarded to the Alarm Module (IZ-Ox 12), the logic will calculate the subcooling margin by subtracting Tincom from TSAT(-err). If the value is positive, this will indicate that there is an adequate SCM, whereas a negative value will indicate that there is a LOSCM and the alarm module will be tripped. In order for this step to be successful, the three input signals must be received from their respective instruments and the Alarm Module must compute the logic correctly.

RCP Trio CH. x (Fault Tree CHANNELx.LGC. Gate GCx-1 033)

Once the system has determined that there is a loss of subcooling margin, it initiates a series of steps to trip the RCPs. In order for this to happen a LOSCM signal must be sent or a channel trip signal must be sent (the channel trip signal only occurs when an upstream modules that would render the channel inoperable is removed). If either of these signals reaches the Channel Trip Module (IZ-Ox-04-06), the system will send a signal to trip the RCPs within 1 minute of reactor trip.

LOHPIFM CH. x (Fault Tree CHANNELx.LGC. Gate GCx-1 030)

There are three criteria that are considered; HPI Flow, HPI Flow Required, and RCP Trip.

The system calculates the HPI Flow Margin in Alarm Module (IZ-Ox-05-14) by subtracting the HPIFRequir from the HPIFMeasurd. If the value is positive, this will indicate that there is adequate HPI Flow, whereas a negative value will indicate that there is a lack of flow and that the FCS needs to be initiated. Once the Train Trip Module has determined whether FCS is needed and that the RCPs should be tripped, a signal is passed on to indicate a loss of HPI Flow Margin.

Output Gates The following gates represent the Channel x signal outputs from Cabinet x:

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 23 of 250 Revision 1 Gate Si.nal GCx-CAB10 CH. x FCS to Train A GCx-CAB 13 CH. x FCS to Train B GCx-CAB40 CH. x EFIC ISCM Level to Train A GCx-CAB43 CH. x EFICPSCM Level to Train B GCx-CAB70 CH. x RCP Trip to Train A GCx-CAB73 CH. x RCP Trip to Train B Additionally, Cabinets 1 and 2 process signals for the MCB Display functions. The output gates for the MCB displays are:

Gate Indication GCx-201 0 HPIFM -800 to +800 gpm GCx-2110 SCM/SH -800 to +800 Deg F GCx-2113 Incore Indicator Light GCx-2150 RTD Indicator Light GCx-2153 Superheat Indicator Light 3.2.4.2 Group 2: Trip Train and MCB Display Logic Four fault trees develop the Train Trip A and B logic for the four ICCMS functions being evaluated (FCS.LGC, EFIC-SET.LGC, RCP-TRP.LGC, and MCB-DISP.LGC). These fault trees are presented in Appendix C as Figures C-4, C-5, C-6, and C-7 respectively.

The top fault tree gates for the 4 trip functions are:

Gate Function GFCS-00 Failure of FCS to open either MSV-25 or MSV-26 GEF-ISCM 10 Failure of EFIC ISCM Setpoint Signal GTR-RCP10 Failure to trip all 4 RCPs GMCB DIS10 Failure of MCB Display The Train Trip Logic for FCS, EFIC ISCM, and RCP Trip is essentially the same. The 3 channel trip signals are processed in TTM2500 (IZ-Ox-03-10 for FCS and IZ-Ox-03-08 for EFIC ISCM Setpoint and IZ-Ox-03-06 for RCP Trip). 2 of the 3 signals are needed to generate a Train Trip.

Once the Train Trip signals are generated for these functions they are processed differently.

For FCS function, the Train Trip A and B signals are both sent to MSV-25 and MSV-26; either the A or B signal is sufficient for success. For the EFIC ISCM Setpoint function, either the A or B signal is sufficient for success. For the RCP Trip function, the Train Trip A and B signals are sent to each of the 4 RCPs. Either signal will trip an RCP and success of the function requires that all 4 RCPs receive a trip signal.

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................ A M17877-0001-100 S(,,TH11, Task 1 - ICCMS 100% Reliability Assessment Page 24 of 250 Revision 1 3.2.4.3 Group 3: Power Supply Logic The remaining fault tree represents the power supplies for the cabinets (POWER.LGC).

This fault tree is presented in Appendix C as Figure C-8.

The power supply logic is straightforward. Each contains 2 redundant power supplies that feed into power supply Module (IZ-Ox-04-01 for the cabinets x and IZ-Ox-03-01 for Train Trip channels A and B). The top gates for these power supplies are:

Gate Usage GPW-CH110 Channel Power Cabinet 1 GPW-CH21 0 Channel Power Cabinet 2 GPW-CH310 Channel Power Cabinet 3 GPW-TTA1 0 Trip Train A Power Cabinet 1 GPW-TTB 10 Trip Train B Power Cabinet 2 3.2.5 Quantification The fault trees described above were linked and solved using the batch process in WinNUPRA. Each of the 4 top gates, corresponding to the 4 functions being evaluated in this analysis, was solved twice. The first solution for each function was performed with the Availability Database (WinNUPRA data file ICCMS-AV.BED) and the second solution was performed with the Reliability Database (WinNUPRA data file ICCMS-RL.BED). Note that the WinNUPRA results with the Reliability Database are calculated on a per hour basis. The results obtained are as follows (WinNUPRA file ICCMS-ALL.OUT).

Availability Quantification:

Equation Database Top Gate Unavailability # Cutsets AV-FCS.EQN ICCMS-AV GFCS-00 6.295E-06 11,696 AV-EFIC.EQN ICCMS-AV GEF-ISCM10 8.649E-07 6,196 AV-RCPT.EQN ICCMS-AV GTR-RCP1 0 8.119E-07 6,201 AV-MCBD.EQN ICCMS-AV GMCB-021 0 8.470E-07 2,128 Reliability Quantification:

Equation Database Top Gate Failure Rate # Cutsets RL-FCS.EQN ICCMS-RL GFCS-00 1.687E-07 10,687 RL-EFIC.EQN ICCMS-RL GEF-ISCM10 2.313E-08 5,803 RL-RCPT.EQN ICCMS-RL GTR-RCP1 0 2.177E-08 5,814 RL-MCBD.EQN ICCMS-RL GMCB-0210 2.535E-08 1,935 The top 50 cutset combinations for each of the above functions are presented in Appendix D as Figures D-1 through D-8. These listings are EQD files generated in WinNUPRA.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 25 of 250 Revision 1 The logic model is developed in and evaluates failure of the function. Thus, the availability for each function is then calculated as:

AVAILABILITY = 1.0 - UNAVAILABILITY This calculation was performed in EXCEL with the following results:

AVAILABILITY FUNCTION/REQ FAILURE RATE AVAILABILITY HPI FLOW (FCS INIT) 6.30E-06 0.99999371 SG LEVEL (EFIC ISCM) 8.65E-07 0.99999914 RCP TRIP 8.12E-07 0.99999919 REG 1.97 8.47E-07 0.99999915 The logic model is developed in and evaluates failure of the function. Thus, the reliability for each function is then calculated as:

RELIABILITY1 = 1 / FAILURE RATE, The Reliability model results were evaluated with 3 different mission times. These are a 184 day surveillance period, a 1 year period, and a 1.5 year period. These calculations were performed in EXCEL with the results presented in the tables below.

Reliability for 184 day surveillance period FUNCTION/REQ FAILURE RATE RELIABILITY HPI FLOW (FCS INIT) 1.69E-07 0.999255298 SG LEVEL (EFIC ISCM) 2.31E-08 0.999897863 RCP TRIP 2.18E-08 0.999903868 REG 1.97 2.54E-08 0.999888061 Reliability for 1 yr. period FUNCTION/REQ FAILURE RATE RELIABILITY HPI FLOW (FCS INIT) 1.69E-07 0.998523279 SG LEVEL (EFIC ISCM) 2.31E-08 0.999797402 RCP TRIP 2.18E-08 0.999809313 REG 1.97 2.54E-08 0.999777959 Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 26 of 250 Revision 1 Reliability for 1.5 yr. period FUNCTION/REQ FAILURE RATE RELIABILITY HPI FLOW (FCS INIT) 1.69E-07 0.997785737 SG LEVEL (EFIC ISCM) 2.31E-08 0.999696118 RCP TRIP 2.18E-08 0.999713983 REG 1.97 2.54E-08 0.999666956 Task 1 - Reliability Assessment for CR-3 ICCMS

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__ CR-3 ICCMS RAM 17877-0001-100 Page 27 of 250 Task I - ICCMS 100% Reliability Assessment Revision 1 4.0 APPLICABLE SCIENTECH QAM/SOPS Scientech standards for performing all consulting services are subject to the Scientech Quality Assurance Manual [4]. The Scientech Quality Assurance Manual outlines the specific procedural requirements related to the control and assurance of technical quality. It is the policy of Scientech to perform all technical work in compliance with the Scientech Corporate Quality Assurance requirements, and to perform work related to nuclear power plant safety in accordance with the requirement of Title 10 of the Code of Federal Regulations, Part 50, Appendix B. Safety-related activities of the Generation Services Division personnel are subject to the reporting requirements of the Code of Federal Regulations, Title 10, Part 21. The Scientech Quality Assurance Manual documents a systematic program to assure that all activities affecting the quality of nuclear work implement that policy.

Task 1 - Reliability Assessment for CR-3 ICCMS

Task CR-31S Bike.CR-3ICCM RAM RAM17877-0001-100 Proj. No: 17877 Task 1 - ICCMS 100% Reliability Assessment Page 28 of 250 Revision 1 5.0 ASSUMPTIONS The analysis presented in this report is based on the ICCMS Block Diagram presented in Appendix A. This diagram was used to provide insights into the operational impacts of system faults and following signal paths from beginning to end. The following assumptions were made in the development of the availability/reliability model for the ICCMS:

1. The data for all of the system modules is developed from the parts lists for each module and calculated with the manufacturer supplied data or, when manufacturer data was not available, data from a similar component or generic data. The module level data was assembled using the sum of the parts method.

2. The Class 1E external power sources to each of the 3 channel cabinets are assumed to be available. There are also non-safety power sources to the cabinets, which may or may not be available.

3. The external power sources to the MCB RG 1.97 display functions are assumed to be available. These power sources are class 1E.

4. The analysis does not consider room ventilation.

5. It is assumed that the instrumentation or the components that provide inputs to the ICCMS are available. Therefore, the following components are assumed to be available:

a. Core Exit Thermocouples

b. Wide Range RCS Pressure signal

c. Low Range RCS Pressure signal

d. Reactor Trip Breaker position signals

e. HPI Flow Instrumentation

6. As provided by CR-3, the expected delay time from fault identification to initiating maintenance is assumed to be 4 hours4.62963e-5 days 0.00111 hours 6.613757e-6 weeks 1.522e-6 months and the expected delay time from the time that repair has been completed until the channel/train is restored to service is 2 hours2.314815e-5 days 5.555556e-4 hours 3.306878e-6 weeks 7.61e-7 months .

Therefore, it is assumed in this analysis that the MLDT is 6 hours6.944444e-5 days 0.00167 hours 9.920635e-6 weeks 2.283e-6 months .

7. The impact of the Channel Critical Module Withdrawal is not modeled. When activated, this function trips the associated channel logic when a critical module is removed. When this occurs, the trip logic changes from 2 of 3 to 1 of 2, thus the reliability of the system in accomplishing its safety function is increased.

8. It is assumed that failure of Backplane 1 (one located in Cabinet 1, one located in Cabinet 2) only impacts the associated Trip Train Logic (Trip Train A in Cabinet 1 or Trip Train B in Cabinet 2).

9. Since the components contained on Backplanes 1 through 6 differ significantly, unique data was developed for each of the 6 backplane types.

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10. While it is recognized that the fiber optic transitions ("electric signal to light" and "light to electric") are physically mounted on a backplane, the failures of these components are included within the associated module. This better correlates the impact of the failure of these components.

11. The logic model develops signals for Channel 3 TSAT(nom) and Channel 3 TSAT(+err).

However, these signals are not currently used in the system or the RAM model. This logic is being retained in the 100% model for potential future use.

12. To determine the correct In-Core temperature, it is assumed that only 1 of the 8 input signals must function for the system to respond properly. Since the Hi Auctioneer module selects the highest temperature and passes the information on to process, as long as one of the eight input signals is working, the system will be able to calculate the adequate amount of flow needed.

13. In the calculation for HPI flow, the flow is summed and averaged from the 4 trains. It is assumed that the system will respond properly only if all 4 trains are functioning.

14. It is assumed in the Uncertainty Analysis that all data are lognormal distributions with an Error Factor of 3.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 Oi~k6-VMCR-3 SIif ICCMS RAM Task 1 - ICCMS 100% Reliability Assessment 18700-0 17877-0001-100 Page 30 of 250 Revision 1 6.0 RESULTS The results can be divided into 2 groups; the Availability Model and the Reliability Model.

These are discussed separately in the sections below following a discussion of Importance measures.

6.1 Measures of Importance An importance measure gives a quantitative answer to the question: "How much do the point estimates of the various events contribute to the final estimate of the outcome (the outcome frequency)?" The following sections discuss the most common importance measures and how they are calculated. For the ICCMS analysis, Risk Reduction Worth (RRW) is the importance measure used.

Fussell-Vesely Importance Various accepted measures of importance use different conceptual and computational approaches to answer this question. For example, the Fussell-Vesely Importance, which is one of the measures computed by WinNUPRA, defines the importance of a basic event i for top event E as the probability that i contributes to the occurrence of E, given that E has occurred. When applied to the cutset equation for the occurrence of E, this definition implies that a basic event's contribution to the sequence frequency is determined by the number of times that basic event appears, not by the point estimate of the event i. Thus, if two basic events appear in exactly the same cutsets, their Fussell-Vesely Importance is the same, no matter how much their individual point estimates differ. This measure is shown below as:

Si, S j IFV = j --

K ZSk k I where:

IFV = Fussell - Vesely Importance for basic event i Sij = Probability estimate for cutset j containing event i Sk = Probability estimate for a minimal cutset of the outcome of interest K = Total number cutsets in equation J = Total number of cutsets containing event i Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 17877-0001-100 Task 1 - ICCMS 100% Reliability Assessment Page 31 of 250 Revision 1 Risk Achievement Worth Risk Achievement Worth (RAW) represents the change in outcome frequency for a worst-case scenario: one in which a component always fails. It is useful for identifying those system elements that are crucial in maintaining the current level of risk and that should not be allowed to deteriorate. This measure is shown below as:

RAW/ = 1 + IFV (p 1) where p;o = basic event unavailability for event i Risk Reduction Worth Similarly, Risk Reduction Worth (RRW), which represents the change in outcome frequency if the probability of basic event i is reduced to zero, aids in setting design improvement priorities. The greater the Risk Reduction Worth of a basic event, the greater will be the reduction in outcome frequency from an improvement in the failure rate associated with the event. Risk Reduction Worth is shown as:

RRW = (I -IFV)I Birnbaum Importance Bimbaum's Measure of Component Importance for non-coherent Systems, S. Beeson and J. D. Andrews, Department of Mathematical Sciences, Loughborough University; Loughborough, Leicestershire, UK.

When assessing a system, its performance is dependent on that of its components. Some components will play a more significant role in causing or contributing to system failure than others. The concept of importance measures is to numerically rank the contribution of each component or basic event to reflect the susceptibility of the system to the occurrence of this event.

In 1969 Bimbaum introduced the concept of importance and developed a probabilistic measure of component reliability importance. This measure is denoted by GI(q) and defined as the probabilitythat component i is critical to system failure, i.e. when i fails it causes the system to pass from a working to a failed state. Birnbaum's measure is also referred to as the criticality function and is expressed as:

Gi(q) = Osrs(lq)-Qss( Oq)

Task 1 - Reliability Assessment for CR-3 ICCMS

fProj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task 1 - ICCMS 100% Reliability Assessment Page 32 of 250 Revision 1 Where Qsys(li,q) is the probability that the system fails with component i failed and Qsys(0j,q) is the probability that the system fails with component i working and q denotes the vector of component unreliabilities for the remaining components.

6.2 Availability Results The results obtained in the evaluation of the Availability Models are as follows:

[ AVAILABILITY I FUNCTION/REQ FAILURE RATE AVAILABILITY HPI FLOW (FCS INIT) 6.30E-06 0.99999371 SG LEVEL (EFIC ISCM) 8.65E-07 0.99999914 RCP TRIP 8.12E-07 0.99999919 REG 1.97 8.47E-07 0.99999915 As can be seen from the above, the availability requirement of 0.999 availability is easily met by the system as designed. In fact, all 4 of the functions evaluated exceeded this value by about a factor of almost 1,000. When initially looking at the results, the higher failure rate/lower availability of the HPI FLOW (FCS INIT) function stands out. This is due to the fact that there are 3 parameters involved in this function (HPI calculated flow, HPI actual flow, and rector trip). SG LEVEL (EFIC ISCM) and RCP TRIP involve only one input (RCP Trip). The RG 1.97 MCB displays are each generated from only 2 partial functions resulting in a slightly lower failure rate/slightly higher availability than SG LEVEL (EFIC ISCM) and the RCP TRIP functions.

Dominant Contributors The cutsets generated for the 4 cases evaluated are presented in Appendix D as Figures D-1 through D-4. The database used in quantifying these cases is presented in Appendix D as Figure D-9.

An Importance Analysis was performed for each case and these are presented in Appendix E as Figures E-1 through E-4. All contributors with a RRW of 1.050 or greater are presented below.

HPI FLOW (FCS INIT)

Based on the Importance Analysis presented in Appendix E, Figure E-1, the dominant contributors to safety function failure are failure of the GEN2500 Modules (RRW of 1.064)

The dominant contributor to failure in the GEN2500 Modules is item number 21, T491a225K016AT, Capacitor, Tantalum, 2.2uF, 16V, 10%, SMD, Case Size A. 2 are used with a MTBF of 1.82E+5 hours.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 0CR-3100% lOOMS RAM 17877-0001-100 STask 1 - ICCMS Reliability Assessment Page 33 of 250 Revision 1 Note that each of the Modules was evaluated using the Sum of the Parts Method. The individual contributors to the failure of each module are shown in Appendix B.

SG Level (EFIC ISCM)

Based on the Importance Analysis presented in Appendix E, Figure E-2, the dominant contributors to safety function failure are failure of the GEN2500 Modules (RRW of 1.170) followed by followed by failure of the ALM2500 Modules (RRW of 1.093). This is followed by failure of the PSM2500 modules (RRW of 1.081), and failure of the AIM2500 Modules (RRW of 1.076).

The dominant contributor to failure in the GEN2500 Modules is item number 21, T491a225K016AT, Capacitor, Tantalum, 2.2uF, 16V, 10%, SMD, Case Size A. 2 are used with a MTBF of 1.82E+5 hours.

The dominant contributor to failure in the ALM2500 Modules is item number 40, CMF5510MOOOFHEK, Resistor, Carbon Film, 5%, 1/4W(MIN), 10MOhm with a MTBF of 1.38E+5 hours.

The dominant contributor to failure in the PSM2500 Modules is items number 29 (RS-2412DZ) and 30 (RS-2412S), DC to DC converters, each with a MTBF of 1.40E+6 hours.

The dominant contributor to failure in the AIM2500 Modules is item number 10, TAP105K035S Capacitor, Tantalum, 10%, 1uF, 35V with a MTBF of 3.35E+6, noting that 12 of this component are required per module.

Note that each of the Modules was evaluated using the Sum of the Parts Method. The individual contributors to the failure of each module are shown in Appendix B.

RCP Trip Based on the Importance Analysis presented in Appendix E, Figure E-3, the dominant contributors to safety function failure are failure of the GEN2500 Modules (RRW of 1.174) followed by the failure of the ALM2500 Modules (RRW of 1.095). This is followed by failure of the PSM2500 modules (RRW of 1.083), and failure of the AIM2500 Modules (RRW of 1.077).

The dominant contributor to failure in the GEN2500 Modules is item number 21, T491a225K016AT, Capacitor, Tantalum, 2.2uF, 16V, 10%, SMD, Case Size A. 2 are used with a MTBF of 1.82E+5 hours.

The dominant contributor to failure in the ALM2500 Modules is item number 40, CMF5510MOOOFHEK, Resistor, Carbon Film, 5%, 1/4W(MIN), 10MOhm with a MTBF of 1.38E+5 hours.

Note that each of the Modules was evaluated using the Sum of the Parts Method. The individual contributors to the failure of each module are shown in Appendix B.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 34 of 250 Revision 1 RG 1.97 MCB Display Based on the Importance Analysis presented in Appendix E, Figure E-4, the dominant contributors to function failure are failure of the GEN2500 Modules (RRW of 1.147) followed failure of the DSM2500 modules (RRW of 1.088). This is followed by failure of the ALM2500 Modules (1.081), PSM2500 modules (RRW of 1.071), and failure of the AIM2500 Modules (RRW of 1.066).

The dominant contributor to failure in the GEN2500 Modules is item number 21, T491a225K016AT, Capacitor, Tantalum, 2.2uF, 16V, 10%, SMD, Case Size A. 2 are used with a MTBF of 1.82E+5 hours.

The dominant contributor to failure in the DSM2500 Modules is item number 37, CMF551CMOOOFHEK, Resistor, Carbon Film, 6%, 1/4W(MIN), 10kW with a MTBF of 1.38E+5 hours.

The dominant contributor to failure in the ALM2500 Modules is item number 40, CMF5510MOOOFHEK, Resistor, Carbon Film, 5%, 1/4W(MIN), 10MOhm with a MTBF of 1.38E+5 hours.

The dominant contributor to failure in the PSM2500 Modules is items number 29 (RS-2412DZ) and 30 (RS-2412S), DC to DC converters, each with a MTBF of 1.40E+6 hours.

The dominant contributor to failure in the AIM2500 Modules is item number 10, TAP105KO35S Capacitor, Tantalum, 10%, luF, 35V with a MTBF of 3.35E+6, noting that 12 of this component are required per module.

Note that each of the Modules was evaluated using the Sum of the Parts Method. The individual contributors to the failure of each module are shown in Appendix B.

6.3 ReliabilityResults The reliability was evaluated using the system wide failure rate as calculated using the fault tree analysis discussed above and the mission time equal to that of the Surveillance Test Interval wherein the system is verified operable. The Surveillance Test Interval had been defined by CR-3 as 184 days. Using this definition the system satisfies the 0.999 reliability requirement.

[ Reliability for 184 day surveillance period FUNCTION/REQ FAILURE RATE RELIABILITY HPI FLOW (FCS INIT) 1.69E-07 0.999255298 SG LEVEL (EFIC ISCM) 2.31E-08 0.999897863 RCP TRIP 2.18E-08 0.999903868 REG 1.97 2.54E-08 0.999888061 Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877

__ CR-3 ICCMS RAM 17877-0001-100 Task 1 - ICCMS 100% Reliability Assessment Page 35 of 250 Revision 1 It should be noted that the HPI FLOW (FCS INIT) function just exceeds the requirement of

.999 by a slim margin.

Dominant Contributors The cutsets generated for the 4 cases evaluated are presented in Appendix D as Figures D-5 through D-8. The database used in quantifying these cases is presented in Appendix D as Figure D-10.

An Importance Analysis was performed for each case and these are presented in Appendix E as Figures E-5 through E-8. All contributors with a RRW of 1.050 or greater are presented below.

HPI FLOW (FCS INIT)

Based on the Importance Analysis presented in Appendix E, Figure E-5, the dominant contributors to safety function failure is failure of the GEN2500 Modules (RRW of 1.057).

The dominant contributor to safety function failure in the GEN2500 Modules is item number 21, T491a225K016AT, Capacitor, Tantalum, 2.2uF, 16V, 10%, SMD, Case Size A. 2 are used with a failure rate of 1.1OE-5 per hour.

Note that each of the Modules was evaluated using the Sum of the Parts Method. The individual contributors to the failure of each module are shown in Appendix B.

SG Level (EFIC ISCM)

Based on the Importance Analysis presented in Appendix E, Figure E-6, the dominant contributors to safety function failure are failure of the GEN2500 Modules (RRW of 1.170),

failure of the ALM2500 Modules (RRW of 1.093), failure of the PSM2500 Modules (RRW of 1.081), and failure of the AIM2500 Modules (RRW of 1.076).

The dominant contributor to failure in the GEN2500 Modules is item number 21, T491a225K016AT, Capacitor, Tantalum, 2.2uF, 16V, 10%, SMD, Case Size A. 2 are used with a failure rate of 1.10E-5 per hour.

The dominant contributor to failure in the ALM2500 Modules is item number 40, CMF5510MOOOFHEK, Resistor, Carbon Film, 5%, 1/4W(MIN), 10MOhm with a failure rate of 7.23E-6 per hour.

The dominant contributor to failure in the PSM2500 Modules is items number 29 (RS-2412DZ) and 30 (RS-2412S), DC to DC converters, each with a MTBF of 7.15E-7 per hour, noting that there are several per module.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 36 of 250 Revision 1 The dominant contributor to failure in the AIM2500 Modules is item number 24, RS-2412D, DC/DC Converter, 2W, 24VDC Input, +/- 12 VDC Output with a MTBF of 7.15E-7 per hour, noting that 5 of this component are required per module.

Note that each of the Modules was evaluated using the Sum of the Parts Method. The individual contributors to the failure of each module are shown in Appendix B.

RCP Trip Based on the Importance Analysis presented in Appendix E, Figure E-7, the dominant contributors to safety function failure are failure of the GEM2500 Modules (RRW of 1.174) followed by failure of the ALM2500 Modules (RRW of 1.095), failure of the PSM2500 Modules (RRW of 1.083), and failure of the AIM2500 Modules (RRW of 1.078).

The dominant contributor to failure in the GEN2500 Modules is item number 21, T491a225K016AT, Capacitor, Tantalum, 2.2uF, 16V, 10%, SMD, Case Size A. 2 are used with a failure rate of 1.10E-5 per hour.

The dominant contributor to failure in the ALM2500 Modules is item number 40, CMF5510MOOOFHEK, Resistor, Carbon Film, 5%, 1/4W(MIN), 10MOhm with a failure rate of 7.23E-6 per hour.

The dominant contributor to failure in the PSM2500 Modules is items number 29 (RS-2412DZ) and 30 (RS-2412S), DC to DC converters, each with a MTBF of 7.15E-7 per hour, noting that there are several per module.

The dominant contributor to failure in the AIM2500 Modules is item number 24, RS-2412D, DC/DC Converter, 2W, 24VDC Input, +/- 12 VDC Output with a MTBF of 7.15E-7 per hour, noting that 5 of this component are required per module.

Note that each of the Modules was evaluated using the Sum of the Parts Method. The individual contributors to the failure of each module are shown in Appendix B.

RG 1.97 MCB Display Based on the Importance Analysis presented in Appendix E, Figure E-8, the dominant contributors to function failure are failure of the GEN2500 Modules (RRW of 1.138) followed by failure of the DSM Modules (RRW of 1.084), failure of the ALM2500 modules (RRW of 1.076), failure of the PSM2500 Modules (RRW of 1.067), failure of the LEDs (RRW of 1.067), and failure of the AIM2500 Modules (RRW of 1.063).

The dominant contributor to failure in the GEN2500 Modules is item number 21, T491a225K016AT, Capacitor, Tantalum, 2.2uF, 16V, 10%, SMD, Case Size A. 2 are used with a failure rate of 1.1OE-5 per hour.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 37 of 250 Revision 1 The dominant contributor to failure in the DSM2500 Modules is item number 37, CMF551CMOOOFHEK, Resistor, Carbon Film, 6%, 1/4W(MIN), 10kW with a failure rate of 7.23E-6 per hour.

The dominant contributor to failure in the ALM2500 Modules is item number 40, CMF5510M000FHEK, Resistor, Carbon Film, 5%, 1/4W(MIN), 10MOhm with a failure rate of 7.23E-6 per hour.

The dominant contributor to failure in the PSM2500 Modules is items number 29 (RS-2412DZ) and 30 (RS-2412S), DC to DC converters, each with a MTBF of 7.15E-7 per hour, noting that there are several per module.

The dominant contributor to failure in the AIM2500 Modules is item number 24, RS-2412D, DC/DC Converter, 2W, 24VDC Input, +/- 12 VDC Output with a MTBF of 7.15E-7 per hour, noting that 5 of this component are required per module.

Note that each of the Modules was evaluated using the Sum of the Parts Method. The individual contributors to the failure of each module are shown in Appendix B.

Uncertainty Analysis An uncertainty analysis was performed on system reliability to gain additional insight. Note that performing an uncertainty analysis is not required. This is presented at the 5%, Median, Mean, and 95% levels for each evaluated function.

HPI FLOW (FCS INITI- Reliability for 184 day surveillance oeriod FUNCTION/REQ FAILURE RATE RELIABILITY 5% 4.46E-08 0.999802933 Median 1.39E-07 0.999385923 Mean 1.96E-07 0.999136162 95% 5.17E-07 0.997719973 SG LEVEL (EFIC ISCM) - Reliability for 184 day surveillance period FUNCTION/REQ FAILURE RATE RELIABILITY 5% 8.15E-09 0.999964015 Median 2.07E-08 0.999908461 Mean 2.57E-08 0.999886427 95% 6.04E-08 0.999733353 Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 SCR-3 ICCMS RAM 17877-0001-100 Task I - ICCMS 100% Reliability Assessment Page 38 of 250 Revision 1 RCP TRIP - Reliability for 184 day surveillance period FUNCTION/REQ FAILURE RATE RELIABILITY 5% 7.62E-09 0.999966373 Median 1.95E-08 0.999913980 Mean 2.43E-08 0.999892741 95% 5.61E-08 0.999752293 RG 1.97 - Reliability for 184 day surveillance period FUNCTION/REQ FAILURE RATE RELIABILITY 5% 9.19E-09 0.999959409 Median 2.22E-08 0.999902102 Mean 2.82E-08 0.999875565 95% 6.52E-08 0.999712030 As can be seen from the above, for the 184 day Surveillance Test Interval time period of the functions meet the 0.999 requirement for the distribution parameters with the exception of HPI FLOW (FCS INIT) at the 95% value. These results are consistent with the point estimate results.

The mean value calculated in the uncertainty estimate will vary between simulations due to the randomly selected seed value used in the Monte-Carlo simulation. Thus, given the small margin by which the .999 goal was achieved in the point estimate it is expected that on average the Monte-Carlo simulation mean value would exceed the point estimate value roughly half the time and roughly half the time it would be lower (meeting the .999 requirement). Given the slim margin at the mean value it is expected that the .999 requirement would not be met at the 95%.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 SCR-3 Task I - ICCMS 100% ICCMS RAM Reliability Assessment 17877-0001-100 Page 39 of 250 Revision 1

7.0 CONCLUSION

S As part of the task to determine the reliability of the Inadequate Core Cooling Mitigation System (ICCMS), a RAM model was developed and evaluated for the system functions. Review of the cutsets presented in Appendix D verifies that there are no single failures in the system as designed.

When considering these results for the 100% design, there are two factors that should first be considered.

1. System design revisions in response to the initial testing of the modules are nearly complete, but are still in progress. This could impact the availability and reliability of the modules. However, any impacts at this point are expected to be very minor.

2. The module parts lists have been revised, but are still under revision. This could impact the availability and reliability of the modules. However, any impacts at this point are expected to be minor.

Given the nearly final state of the system design and considering the above, there is only a slim opportunity for the results obtained in the 100% analysis to change when the remaining changes are finalized, and this should be considered when interpreting these results.

7. 1. 1 Availability Analysis Conclusions For the Availability Analysis, the system was found to not only meet but to exceed by a factor of nearly 1,000 the availability goal of 0.999. The availability of the system was found to be very robust.

7.2.2 Reliability Analysis Conclusions For the Reliability Analysis, the reliability goal of 0.999 was met. For the Reliability Analysis for a 184 day Surveillance Period, the system was found to satisfy the desired reliability of 0.999 for the point estimate (mean value calculation). The uncertainty analysis highlights the thin margin by which this reliability goal was met for the HPI FLOW (FCS INIT) function.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 STask I - ICCMS 100% Reliability Assessment Page 40 of 250 Revision 1

8.0 REFERENCES

1. ANS/IEEE Std 352-1987 "IEEE Guide for General Principles of Reliability Analysis of Nuclear Power Generating Station Safety Systems," November 21, 1987.

2. "CR-3 ICCMS Project Plan," Revision 1, Scientech, October, 2011.

3. "CR-3 ICCMS Task Plan 1," Revision 0, Scientech, October, 2011.

4. "Quality Assurance Manual," Scientech, Inc., Revision 8, September 31, 2011.

5. "ICCMS BLOCK DIAGRAM, GENERAL," file named: NUS-A304DB Revision 3 ICCMS Block Diagrams.pdf, 02-21-2012.

6. "CR-3 ICCMS RAM, Task 1 ICCMS 30% RAM", Revision 0, October 2011.

7. "CR-3 ICCMS RAM, Task 3 - Manufacturer's Data Collection," 17877-0001, Final Draft, January 2012.

8. "CR-3 ICCMS RAM, Task 3 - ICCMS 60% Design FMEA," 17877-0002-60, March, 2012.

9. "Analog Input Module Parts List," NUS-A323PA, Rev. B Red-Line, current as of June 12, 2012.

10. "Analog Output Module Parts List," NUS-A324PA, Rev. A Red-Line, current as of June 12, 2012.

11. "Contact Input Module Parts List," NUS-A325PA, Rev. 0, current as of June 12, 2012.

12. "Contact Output Module Parts List," NUS-A326PA, Rev. 0, current as of June 12, 2012.

13. "Functions Generator Module Parts List," NUS-A327PA, Rev. A Red-Line, current as of March 12, 2012.

14. "Power Supply Monitor Module Part List," NUS-A328PA, Rev. A Red-Line, current as of June 12, 2012.

15. "Alarm Module Parts List," NUS-A329PA, Rev. A Red-Line, current as of June 12, 2012.

16. "Reactor Trip Module Parts List," NUS-A330PA, Rev. 0, current as of June 12, 2012.

17. "Summer Module," NUS-A331 PA, Rev. A Red-Line, current as of June 12, 2012.

18. "Display Select Module Parts List," NUS-A332PA, Rev. A Red-Line, current as of June 12, 2012.

19. "HI Auctioneer Module Parts List," NUS-A333PA, Rev. 0, current as of June 12, 2012.

Task 1 - Reliability Assessment for CR-3 ICCMS

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_Tkfw-~

S("IHItTask

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1-CR-3 ICCMS RAM ICCMS 100% Reliability Assessment 17877-0001-100 18700-0 Page 41 of 250 Revision 1

20. 'Channel Trip Module Parts List," NUS-A334PA, Rev. A Red-Line, current as of June 12, 2012.

21. "Train Trip Module Parts List," NUS-A335PA, Rev. 0, current as of June 12, 2012.

22. "Difference Module," NUS-A339PA, Rev. A Red-Line, current as of June 12, 2012.

23. "Filler Module Parts List," NUS-A341 PA, Rev. 0, current as of June 12, 2012.

24. "ICCMS Rack Backplane Parts List," NUS-C099PA, Rev. C, current as of March 12, 2012.

25. "WinNUPRA Version 4.0 Verification and Validation Project," Scientech Project 17279-0001, June 2011.

Task 1 - Reliability Assessment for CR-3 ICCMS

Proj. No: 17877 CR-3 ICCMS RAM 18700-0 17877-0001-100 MIENTXI Task I - ICCMS 100% Reliability Assessment Page 42 of 250 Revision 1 Appendix A ICCMS Block Diagram Task 1 - Reliability Assessment for CR-3 ICCMS

I/V I/V Trip Channel 1 I/V

[IV Cabinet 1*

Shaded Modules on MCB I/V I/V 1GOt- IP FOF IN IN

-V.-

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- INv vv Trip Channel 2 IN Cabinet 2*

Shaded Modules on MCB

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I A -

A - v/1 -

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L L, I/V Trip Channel 3 I/V Cabinet 3 LI/f I/V r- IN OR V I---V IN'

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FCS Initiation Train A Cabinet 1*

Shaded Modules on MCB TRAINA FCS TO MSV-26 MANUALTRAJ A RESET FCS Initiation Train B Cabinet 2*

Shaded Modules on MCB 1TO MSV-26

EFIC ISCM Setpoint Train A Cabinet 1*

Shaded Modules on MCB

"-1-F J"

_ýFTR.. Ec TRAI. A.E1IC FILTER TRIPOUTPUT Train A Power Supply See FCS Initiation Sheet 4 EFIC ISCM Setpoint Train B Cabinet 2*

Shaded Modules on MCB IZ-02-FILX f" TTRAIN BE ICK EMI/RFI IS"M LEVEL FILTER IUTPUT Train B Power Supply See FCS Initiation Sheet 4

Proj. No: 17877 CR-3 ICCMS RAM 17877-0001-100 Task 1 - ICCMS 100% Reliability Assessment Page 49 of 250 Revision 1 Appendix B ICCMS Module Data Task 1 - Reliability Assessment for CR-3 ICCMS

Module AgIM 62_____

ITEM No. Part No.

.,SIZE AND COLOR AS REQUIRED I?

Component Manufacturer

?

7 I

Task 3 Numbers N/A NIA 1.00E+08 N/A TTM 61 AIM 41 1.00E+08 FGM 32 =JU IC OPT 1MBIT 7ONS: 1.64E+-06 AIM 42 RU IC, Dual, Analog Swit 5.71E+09 57 :UZ IC, Dual, Analog Swit 5.82EiO9 48 TZ IC, Fiber 0pic, Recet 1.D9E+07 55 tZ IC, Fiber Optic, Emitt 4.92E+06 17 08( IT2A Capacitor, Ceramic, D 3.S2E+10 14 T2Q Capacitor, Ceramic, 3.52E+10 08C 18 AT2A Capacitor, Ceramic, 1 3.52E+10 19 T 5S Capacitor, Tantalum, 3.35E+06 15 TA SCS Capacitor, Tantalum, 3.35E+06 20 TA SCS Capacitor, Tantalum, 3.35E+06 15 TLC 5RTA Capacitor, Tantalum, 3.35E+06 21 T 58 Capacitor, Tantalum, 3.35E+06 17 TA SCS Capacitor, Tantalum, 3.35E+06 14 TA SCS Caacitor, Tantalum 3.35E+06 15 TA SCS Capacitor, Tantlum, 3.35E+06 26 LEDHolder 5mm, Du N/A 64 1 Hex Nut, 15/32 N/A 62 8!= E2 Switch, Pushbu itary, Panel Mount 4.20E+07 ET7 45 BE SWITCH, TOGG 7iNY, HORIZONTAL TOGGLE, R/A PC MNT 5.04E+06 ETI 46 BE SwitchToe, F,Horizontal Toggle, R/A PC MNT 5.04E+06 43 ET2 'QE Switch, TogIle, rtical Toggle, R/A PC MNT 5.04E+06 44 ET2 fBE Switch, Togle, Vertical Toggle, R/A PC MNT 5.04E+06 45 TP DO Test Point, Bre. N/A 35 2 r DIP Switch, 8 P !.54 MM 1.68E+06 55 2 k MOSFET, P-CH, )92-3 1.71E+08 21 SM 3-F Transient Volta OV,4OW, SMA 2.16E+07 18 Diode SS Fast I 2.19E+07 47 Diode, Zener,E 4.38E+07 66 Diode, Zener, I 4.38E+07 57 N Channel Eni FET, 6OV, O.2A, T092 1.56E+07 33 N Channel Enhi FET, 6OV, O.2A, T092 1.56E+07 28 2N 6Z N Channel FET, 3.70E+08 25 N Channel FET, 23 1.25E+08 22 H hVoltage G Niode,150V, O.2A 1.96E+08 24 MOSFEG, P-Ch, -23 1.25E+08 31 N-Channel Po-, ET,100V, BOATO-263 1.54E+09 54 IC, 8 PIN DIP0 7.03E+07 36 IC, Optocouple 5.47E+06 51 IIC, 555 Timer, 1 2.OOE.08 23 7 PNP, General P 3.06E+08 AOM 17 Transient Volta 2.19E+08 FGM 20 CC iACTU Capacitor, Cera 805 SMD 2.65E+09 AOM 16 CO ACTU Capacitor, Cera MD 2.65E+09 FGM 16 T .6AT Capacitor, Tant Case Size A 1.82E+05

1.82E+05 3.94E+08 N/A N/A N/A N/A N/A 1.09E+09 7.14E+09 7.14E+09 1.03E+09 2.49E+08 5.AE+07 7.04E+08 2.78E+06 2.78E+06 2.39E+08 2.39E+08 1.00E+08 1.00E+08 1.00E+08 1.00E+08 1.00E+08 1.00E+08 1.008+08 7.69E+08 7.69E+08 7.69E+08

....... .. . . . ..- 7.69E+08 7.69E+08

.... i.......... ?' '* 4 7.69E+08

.................p

7.69E+08 7.698+08

............. " .... " - I, 7.698+08 7.69E+08

............, .... , .-

7.69E+08 7.69E+08 7.69E+08 7.69E+08 7.69E+08 1.26E+08 1.26E+08 1.26E+08 1.13E+07 1.00E+09 1.00E+09 1.00E+09 1.51E+08 3.34E+08 N/A N/A N/A 1.00E+09 4.98E+07

FGM 23 PTO AC/DC 60V -07 COM 35 F .9 PIN -07 FGM 23 A IA -07 FGM 54 ER 12V -11 FGM 60 ER '2V ÷11 FGM 58 ER A4V +11 FGM 53 ERJ 92V -16 FGM 48 ER. )IV +16 AIM 24 nput, +/- 12 VDCOutput .06 DM 20 _ Input, +/-12 VDC Output .06 PSMM 30 Input, +12 VDC Output +06 AIM 8 z /- 15 VDCOUT I, +06 FGM 27 F I onverter, Input, +/-16 VDC Output -06 AIM 3 onerter, Input, +/- 5 VDCOutput .06 CTM 32 Input, +/-5 VDCOutput 036 AIM 20 AIM 7 NL AOM 7 NL N/A COM 7 NL N/A FGM 8 NI N/A FGM 9 NI N/A FGM 10 NI -unaion benerazor -3) N/A FGM 11 NL Function Generator m (-4) N/A FGM 12 NI 1(-5) N/A FGM 13 NI N/A PSMM 7 NL N/A AM 7 NIL N/A RTM 6 NI N/A SM 7 NI ce Plate N/A CTM 7 NI N/A TTM 7 NI Plate, SQRT N/A TM 7 NL Plate N/A DM 7 NIL N/A FGM 64 NI I Then Marked On Part 1.64E+06 FGM 65 NI Then Marked On Part 1.64E+06 FGM 66 NI And Then Marked On Part 1.64E+06 FGM 67 NU $artAnd Then Marked On Part 1.64E+06 FGM 68 NI rt And Then Marked On Part 1.64E+06 FGM 69 NI Part And Then Marked On Part 1.64E+06 DSM 7 NU N/A HIAM 7 NU Plate. SORT N/A

1.92E+07 1.92E+07 1.92E+07 1.92E+07 1.92E+07 1.92E+07 1.92E:+07 1.92E+07 1.92E+07 1.92E+07 1.92E+07 1.92E+07 3.65E+06 6.99E+09 1.09E+09 1.09E+09 1.09E+09 1.09E+09 1.09E+09 1.09E+09 1.09E+09 1.09E+09 MK, Uniondale, NY 3.52E+10 TDK,Uniondale, NY 3.52E+10 TDK, Uniondale, NY 3.52E+10 TDKUUniondalel NY 3.52E+10 TDK, Uniondale, NY 3.52E÷10 TDK, Untiondale NY 3.P.E+10 TDK, Uniondale, NY 3.52E+10 TDK, Uniondale, NY 3.52E+10 "DK, Uniondale, NY 3.52E+10 TDK,Uniondale, NY 3.52E+10 TDK,Uniondale, NY 3.$2E+10 TDK,Uniondale, NY 3.52E÷10 TDK,Uniondale, NY 3.52E÷10 TDK,Uniondale, NY 3,52E÷10 TEConnectivil, Belyn, PA 7.69E+08 TEConnectivity evyP 7.69E+08 TEConnectivily, Selwyn, PA 7.69E+O0 UEConnectlvily, Belwyn, PA 7.69E!+08 TEConnectivily, Belwy, PA 7.69E+09 TEConnectivlyB *yP 7.69E+09 TEConnectivilyB*,P 7.69E+.08 TEConnecttvlyBkyP /

TEConnectivily, Belwyn, PA 7.69E+08 TEConnectivily, Belwy, PA 1.09E+i_0 _.

TEConnectivily, Be.*_n, PA 1.09E+09 TEConnectivily, Bekwyn, PA 1.09E+09 TEConnectivily, Selwyn, PA 7.69E+08 TEConnectivily, Selwy, PA 7.69E+08 1.00E+10 3.71E+08 3.71E+08

3.71E+08 3.71E+08 3.71E+08 3.71E+08 3.71E+08 3.7 1E+08 3.71E+08 3.71E+08 3.68E+08 3.68E+08 3.68E+08 3.68E+08 3.68E+08 3.68E+086 3.68E+08 3.68E+08 3.68E+08 3.68E+08 3.68E+08 3.68E+08 3.68E+09 3.68E+08 3.68E+08 3.68E+08 3.68E+08 3.08E+09 8.67E+08 2.44E+08 2.44E+09 S.aOO+10 N/A N/A N/A N/A N/A N/A N/A N/A 1.OOE+1O 1.OOE+10 1.OOE+3.O 1.OGE+10 1.OOE+10 1.OOE+1O 1.OOE+10 1.38E+O5 1.38E+05 1.38E+05 1.38E+05 1.38E+05 1.38E+05 1.38E+05

PSMM 38 v Resistor, Metal Foil, 0.1%,1W, 0.0054W, SMD, 2512 1.OOE+10 AOM 29 9 LResistor, Metal Foil, 1.OkOhm, 1/10W, 0.01%, 0.2PPM/C, 0805 SMD 1.00E+10 AOM 26 Y4053500ROOOJO L IResistor, Variable, 500, 5%, 1OPPM, 1/4W, 21 Turn, Through Hole 1.OOE+10 AOM 27 Y405310K0000JOL Resistor, Variable, 10K, 0.25W, 21 Turn Through Hole 1.OOE+1O HIAM 25 Y40351KO0000JOL Resistor, Variable, 5% 1/4W, 1KW I.DOE+10 DSM 35 Y50531KOOK JOL Resistor, Variable, 1/4W, 10kW 1.OOE+10 AIM 16 K1O1KIOX7RFSUH5 Capacitor, Ceramic, 10%, 100 pF, 50V 1,41E+08 AOM 31 PL.TOOSZ5001AST5 Resistor, Thin Film, 5.OkOhm, 1/4W, 0.05%, 0805 SMD 1.00E+10 PSMM 32 S17139DP-TI-GE3 P Channel (D-S) MOSFET, 30V, 24A, Power PAKSO-8 9.76E4-09 TM 30 CMF551OMOOOFHEK Resistor, Carbon Film, 5%, 1/4W, (MIN), 10MW 1,39E+05 DSM 37 CMF551CMOOOFHEK Resistor, Carbon Film, 6%, 1/4W, (MIN), lOkW 1.38E+05 FGM 59 CRCWO8O5100RFKEA Resistor, 100 Ohm 1/8W 1% 0805 SMD 1.00E+10 FGM 57 CRCWORO52K49FKEA Resistor, 2.49K Ohm 1/8W 1% 0805 SMD 1.00E+10 FGM 52 TNPWOWO51OK2BEEA Resistor, 10.2K Ohm 1/8W 0.1% 0805 SMD 1.00E+10 AOM 30 TNPW08O51KOOBEEA Resistor, Thin Film, 1.0kOhm, 1/8W, 0.1%, 25PPM/C, 0805 SMD 1.00E+10 AOM 45 TNPOOO5100RBZEN0O Resistor, Thin Film, 0805 SMD, 100 Ohm, 0.1%, 1/8W, 5ppm/C 1.OOE+1O AOM 35 Y4022100ROOOQ0R Resistor, Metal Foil, lOOhm, 0.2W, 0.02%, 0.2PPM/C, 0805 SMD 1.00E+10 FGM 47 Y405310K0000JO Trimmer Resistors - Multi Turn 1240W 10K Ohm 5.0% 1.00E+10 FGM 41 Y4053500R000JO Trimmer Resistors - Multi Turn 1240W 600 Ohm 5.0% 1.001E+10 FGM 49 228-0805-7.68K-RC Thin Film Resistor 7.68K Ohm 0.1% 1OPPM 0805, SMD 6.42E+08 FGM so 2288-0805-4.99K-RC Thin Film Resistor 4.99K Ohm 0.1% 1OPPM 0805, SMD 6.43E+08 HIAM 26 270-1.OK-RC Resistor, Metal Film, 1%, 1/8W, 1KW 6.42E+08 AIM 34 270-1.2K-RC (RNCSSH1201FS) Resistor, Metal Film, 1%, 1/8W, 50 PPM, 1.2 KOhm 6.43E+08 DSM 34 270-1.SK-RC Resistor, Metal Film, 1%, 1/8W, 1.5kW 6.42E+08 DSM 36 270-100K-RC (RNCSSH4702FS) Resistor, Metal Film, 1%, 1/8W, 1OkW 6.42E+08 AIM 27 270-1OK-RC (RNC55H002FS) Resistor, Metal Film, 1%, 1/8W, 50PPM, 1OKOhm 6.42E+08 PSMM 34 270-10-RC Resistor, Metal Film, 1%, 1/8W, 1OW 6.54E+08 AIM 25 270-100-RC (RNCS5H1000FS) Resistor, Metal Film, 1%, 1/2W, 5OPPM, 100 Ohm. 6.42E+08 DM 39 270-1.24K-RC Resistor, Metal Film, 1%, 1/8W, 1.24KW, Thru-hole 6.43E+08 CTM 45 270-11K-RC Resistor, Metal Film, 1%, 1/8W, 11kW 6.42E+08 AIM 35 270-120K-RC Resistor, Metal Film, 1%, 1/8W, 50PPM, 120KOhm 6.42E+08 PSMM 44 270-150K-RC (RNCSSH1503FS) Resistor, Metal Film, 1%, 1/1W, 150W 6.42E+09 AIM 38 270-15K-RC (RNC55H1502FS) Resistor, Metal Film, 1%, 1/8W, 5OPPM, 15KOhm 6.42E+09 AIM 40 270-1K-RC Resistor, Metal Film, 1%, 1/8W, 50PPM, 1KOhm 6.42E+08 AIM 36 270-2.2K-RC (RNC5SH2201FS) Resistor, Metal Film, 1%, 1/8W, SOPPM, 2.2KOhm 6.42E+08 DM 25 270-2.49K-RC Resistor, Metal Film, 1%, 1/8W, 50PPM, 2.49kW, Thru-hole 6.42E+08 AIM 33 270-220-RC Resistor, Metal Film, 1%, 1/2W, 50PPM, 220 Ohm 6.43E+08 RTM 21 270-2K-RC (RNC55H2001FS) Resistor, Metal Film, 1%, 1/8W, 2kW 6.42E+08 COM 29 270-3.9K-RC (RNC55H3901FS) Resistor, Metal Film, 1%, 1/8W, 3.9kW 6.43E+08 AIM 32 270-30K-RC Resistor, Metal Film, 1%, 1/8W, 50PPM, 30 KOhm 6.42E+09 HIAM 30 270-330-RC (RNCS5H330OFS) Resistor, Metal Film, 1%, 1/8W, 330W 6.43E+08 PSMM 48 270-390K-RC Resistor, Metal Film, 1%, 1/8W,3900W 8.11E+08 DM 31 270-4.02K-RC Resistor, Metal Film, 1%, 1/8W, 50PPM, 4.02kW, Thru-hole 6.43E+08 PSMM 50 270-4.22K-RC Resistor, Metal Film, 1%, 1/8W, 4.22W 6.43E+08 CTM 37 270-4.7K-RC Resistor, Metal Film, 1%, 1/8W, 4.7kW 6.43E+08 CTM 39 270-4.99K-RC Resistor, Metal Film, 1%, 1/8W, 4.99kW 6.42E+08 CTM 40 270-44.2K-RC Resistor, Metal Film, 1%, 1/8W, 44.2kW 6.42E+08 DM 30 270-47.SK-RC Resistor, Metal Film, 1%, 1/8W, 50PPM, 47.5kW, Thru-hole 6.42E+08 TrM 38 270-47K-RC (RNCS5HlOO3FS) Resistor, Metal Film, 1%, 1/8W, 47W 6.42E+08 DM 34 270-499K-RC Resistor, Metal Film, 1%, 1/8W, 50PPM, 499W, Thru-hole 1.02E+09 PSMM 46 270-5.1K-RC Resistor, Metal Film, 1%, 1/8W, SAW 6.43E+08 T'M 43 270-SOK-RC Resistor, Metal Film, 1%, 1/8W, 50kW 6.42E+08 DM 37 270-6.2K-RC Resistor, Metal Film, 1%, 1/8W, 50PPM, 6.2KW, Thru-hole 6.43E+08 AIM 29 270-6.8K-RC Resistor, Metal Film, 1%, 1/8W, 5OPPM, 6.8KOhm 6.42E+08 CTM 41 270-68K-RC (RNC55H6802FS) Resistor, Metal Film, 1%, 1/8W, 68kOhm 6.42E+08

PSMM 51 270-7.15K-RC Resistor, Metal Film, 1%, 1/8W, 7.15W DM 32 270-7.5K-RC Resistor, Metal Film, 1%, 1/8W, 50PPM, 7.5kW, Thru-hole DM 35 270-8.06K-RC Resistor, Metal Film, 1%, 1/8W, 5OPPM, 8.06kW, Thru-hole PSMM 37 270-86.6K-RC Resistor, Metal Film, 1%, 1/8W, 8.68W DM 28 270-9.1K-RC Resistor, Metal Film, 1%, 1/8W, 50PPM, 9.1kW, Thru-hole DSM 40 270-90K-RC Resistor, Metal Film, 1%, 1/8W, 90kW RTM 21 270-2.OM-RC (RNC55H2004FS) Resistor, Metal Film, 1%, 1/SW, 2.OMOhm BP 40 273-1K-RC Resistor, Metal Film, 1%, 1/2W, 50ppm, llOhm, ThroughHole BP 41 273-100K-RC Resistor, Metal Film, 1%, 1/2W, SOppm, lOOKOhm, ThroughHole CTM 43 273-150-RC Resistor, Metal Film, 1%, 1/8W, 150kW FGM 43 288-0S05-10K-RC Thin Film Resistor 1OW, 0.1% 1OPPM 0805, SMD FGM 45 288-0505-200-RC Thin Film Resistor 20 Ohm 0.1% 1OPPM 0805, SMD AIM 4 RNC55H9761FS Resistor, Metal Film, 9.76KOhm, 1%, 1/8W AIM 5 RNC55H6651FS Resistor, Metal Film, 6.65KOhm, 1%, 1/8W FGM 46 288-0505-33.2K-RC Thin Film Resistor 3.32 Ohm 0.1% 1OPPM 0805, SMD NOT USED NOT USED NOT USED NOT USED

.IL

QTYeYw Y T i M~d.A I rEM ft. I P- ft. D..~pW.~ Co-opoo M.&-ho -r~ MTBF (HOur) (pa. hoot) (pailoot) Coo.n-I 11 2 3 1 4 1 5 16

Failure Rate houRa Total Failure Rate I

Module I ITEMNo. I Par No. I flecipton I QTYII QTY2 QTY CI 41CTY5ITY 6 Component Manufacturer MTBF(Hours) loer howl}

(per hour)

Comments I 1.92E607 5.21-08 1 5.21E-09 AM 37 270-3.9K-RC I XiconFort Worth, TX 6.43E+09 I 1.56E-09 I 1+56E-09 AM 1 38 RNCSSH9250FS .25Chr, 1 EI I ]I Ior ort Worth,x cn [X 6.43E+08 I 15.60-09 I 1.56E-09 I________________

AM 1 39 1 Y405310K0JOi IResistor, Variable, 10KOhm,5Y, 10PPM, 0.25W, 21 Turn, Throuth Hole V0sha5Precision Group Maliern, PA L0DE+10 I 1.00E-10 I 3.00E-10

-'-'I 270-22K-RC I 'El'.' I 1.56E09 311E-09 I

AM 1 41 6.42E+08 14 6.42E+08 1.56E-09 I 1.56E-09 I 6.42E+096 1.560E-09 I 2.56E-09 m-AM 1 48 1 40.1151 ICornector, Test Jauk.Female 2 POWR96t Angle Thru Hole 3 N/A I N/A I N/A 24 2

1 1

1 AM I 55 I REF1028P I U sTX0 3.68E+00 I 272E-09 I 2,72E-09

)-ol, Analo5 MIL-V AM 1 70 1 ! ICrimpTerminal, Female , IL 7.69E+08 I 1.30E-09 I 3.40E-09

I I I . .. I i i ! i i i I tB4E+04 I

I~l I I I I I I 3w II 9.17E-06 1 1.13E-05OS BLEý 11oM (minute,,

mwT for module (rmnuteýl I I I I I I I 0.993 6,,8E-OS t for Module AVILABILITY TOTAL

Mod.ue ITEMN., Paf No. Detription jQTYI QTY 2QTY 3QTY 4IQTY 5QTY fI Cornporn.t Manufacturer I TF(Rm (pe houorl Total Failure Rate (Parho) cornrents AOM 1 6 1 NUSA324NB-1 AOM 8 IFolm~ildSernkmo-ductoSaoIose. CA I 2.19E.04 I 4.57E-09 I 3ý666-0 12 AOM 1 22 1 1 4 4

2 4

4 4

8

_4_

AO 1 36 1ItG2012N-221-W-T1 41 1.09E+09 9.17E-10 3.67E-09 44 REF1O2AU 3.68E08 I 2.72E-09 I 1.09E-06 no MLDT6 0

I I ____ I______________ I I] I I I I I TOTA 1 0-""" 1___ 1 L02E-0 [AV~AR

m-emearn-n-l-re F.Hur. Rate Total Filure Rate Module I ITEMNo. Par No. Deciption T -1 Com~ponentManufacturer I MTBF(HIM-1 Ceortmert, QTYIQ~Y QY I QTYIQTY 6 (Per It"') (per hour) 1 I

t1 :1 1 1 SeetedsINUSl Ida.ho Falls,ID ScsietedWNUSI Idaho Fa.k, ID 1.921+07 N/A I S21l-O N/A I 5.211-OS NiA

_

_ __E-GB Dooesnot contribete to the faum rate of the )CCMS HIAM 1 22 1 536385-5 I 7.6.+08 1 1.30E-09 I 1.30E-09 9 Xieoe, Fort Worth, Texas 6,44+01.1 1 ISSE-09 1 1.4"-06 1F t W orth, X:[]:-En~ T -~ 6.42E+08 I 156E-09 ] 1.56E.09 _ _ _ _ _ _ _ _ _

HiAM 1 2 1 RINCSSM2103FS Mean, Fort Worth, Te.as 6.42E+06 1.$61 -09 1.61E-09 1

HIAM 1 31 1 Y405351ODOOOOL lesstor, Variale, 5%, 1/4W, Skl Vila.y Pr-*sion Group, Malvern, PA 1.001+10 1.1004-10 1.001-10 1.561-0D9 1361E-09 1.56E-09 TS. Elkhart. IN 5.-1E-07 XINNEaal, TESTLAMllFE1MALE 2 ROW RIGKTANGL.E THRUJ-HOLE Schurier, Sant. Rose, CA N/A I N/A I WA Does not contribute to the failure rate of the ICCMS i-F~[: oe.D.OI. I . .. N/eeet A N...A ~

N/ 'eeo not constribute to the,failure rate of the ICCMS I.....]

4 AnalogDelob., BellesrW 5.42E09 I 1.72E-10 6.871E-10 Geoerni Daft or sirilsar component 4 Tee.. instruments, Dalla, TX I Z."441+08 4.10E-09 1.64E-08 IGeneric Daeeor smiler component HIAM 1 4061 REF1O2P liC,VOLTAGERIEFERENCE, 1Y. 8 PINDIP Tee.. instruments, Dallas, TX 3.6$E-05 I 2.72E-09 I 2.712E-09 Maxim, Suonyvale, CA Tee.s hts~ements, Della.. TX 1 Teese Itstrumet. Delas. TX Team Instruments, Dallas,TX FaidrldSrbemtle*dwtor, San Jose, CA 7.03E.507 1.42E-05 1.14E-07 lGenerkc Data or similarcomponent ParstsenicEledri, Worls, Oaka, Jepe.

Fasrhild SemlkWduot, Sen )e., CA HIAM 1 50 1 Y40S3500R600JL lesistor,Varale, Preoske, 5%, 1/4W, 500 Ohm Vishy Predsion MaW".,, PA 1.0061-0 I 1.0OE-10 I 1.00-10 300 MLDTfor Modul. (minfutes)

I_ I_ IIIII _ _ _ _ _ __ _ I_ _ _ _ _ i r i Ii I__ Tetal 1 0.4901172 1 _ __ 1 253-01 ]hAVAIUBMWfwe.e M-C

Bacimlane MTRF Data It)

Module I ITEMNo. I Part No. Decription 1 21 3174 S7 6 Component Manufacturer Failure Rate loer hour)

Total Failure Rate Iper hour)

I 1.92E+07 5.21E-08 I O.E+0 I I

BP 5 1 -S Vssembly, ICCMSleitiation Channel Badoplae (Cabinet Row 7) I 1.30009 I 9.04-09 1.300-OR 1 5.200-OR 1 _______________________

1 I I I I I IMoles, Lisle, IL I 7.69E090 I 1.o3M-09 I 01100.00 1_2_1_1_1_[i1:1-,ILisle, [ 7.ry9E.06 I 130E_09 I__2__60E__09__I 42919-2212 Connectue, Header, lOre, Vertical, Male, 2 poa 3 Moles. Lisle, IL I 7-69E+06 I 1.30E-,09 I OItE+00 I FJH-125-01-S-D-SM-LC Connector, Header, 8.1%,Vertkil, Mule, SOT, Lootn alp, 50 pos 2 2 2 BP 1 30 EJH-125-01-S-D-SM-LC[Connector, Header, 0.1%.Vertical. Male, SPAT, LockinrgCip, 10 pos 1 1I SP Bp 7T69E+06 I 1.301-09 0I1100.00 I BP 1 37 1 EJH-113-01-F-D-SM-LC 1,30E-09 1 OOE+00 I BP 1 41 1 273-10OK-RC Resistor, Metal Film,,1, 12/2W,SOppm, 100(KOhm,ThroughHole I .TX BeP 44 I S102Kt7KSOOOB Resistor, Metal Flim, 0.1%, 1/SW. 2.5PPM, 7.SKOhrm,ThroUghllole 1 VisWhe 1.00E+10 I 1.00E-10 I O.-0OE00 erIc Data or similar comnonent 1

TAP10OM35SCS l~apacitor,Tantalurn. 1056,loP, 3SVMIN 3.35E+06 I 2.99E-07 I O.0E+00 IGenericData or similar component 9 1.09E+07 I 9.17E-0* 8.26U-07 IGenericData or similar component

BRanblane MTBFData (2)

- ~1 ,-,--r-e-r-r-, r n 7 7 Total Failure Rate Module ITEMNo. Part No. Decripton Failure Rate Q1Y1*T 14Q1y QTy QTY (perhour)

BP BP 5 1 -5 IAssembly,ICXMS Initiation Channel Backplane (Cabinet Row 7)

BP BP :1 -6 lAssembly, ICCMSInitiation Channelfiacbplane (Cabinetlow 8) 10 1 NUS-C-99MC-1 Fabrication, ICCMSActuation Tralne Backplane (Cabinet Row 3) PCO N16c9C 2 lFabeication, ICCMActuationTraionBacbplane I Cabinet Row4)PCB I: I.i1 L~ [

NL-S-t9914C-3 IFabercation,ICCMSActuation Traine Bacplane 2 (Cabinet Row 5) PCB 1 Scieotech/NUSI Idaho Fails, ID 1.92E0)7 I 11E-08

- 1 T -r--- 1-1-T--T--JScientedqNUSI Idaho Falls,ID I 1.92E+D7 I S11IIE-011 _

I I IScientech/NUSIIdaho Falls, ID 1.92E+07 S.21E-08 I 0.tE+00 ID I 1.92E+07 I 1.21043 I .500 ______________I 7.69E+08 I 1.30E-09 I 0.O+00 SP 1 30 I1 BP 31 BP 33 1 E0J-125-01-F-D-SMLC ICornector, Header, 0.05", Vertical, Male, SMT, Locking Clip,50 pos 3 SP' 1 34 1 JH-125-02-f-D-iM-LClConnector, Header, .05", Vert~cal,Male, SPAT. LockingC11p, 50 pos J__ 2 RP I &S 36 IEJ2-113-03-F DSM-LC IConnecPeader, 0.05", Vertcal, Male, SMT, Lckirng Clp, 6 po 12 12 121 tor, Header, 0.05", Vertical, Male, SMT, Locking Clip.26 pos I I I I I I [

tor, Header, 0.05", Vertical, Male, SMT, Locking Clip,26 pos I Samtec, New Albany, IN 7.69E+08 I 1.30E-09 1_4 1 1i1c1n1 Fort Wrtth, TX 642E0+08 1.56E-09 1 )icam, Fort Worth, TX 6.42E00 I 1.56%E-09 0I E+00

_______________ I I.105008 I 1.00438 0050.08 I_____________

1.0011+10 1 1.00E-10 I 000.E08 Iienerc Data or similar component nerlc Data or similar component 4

-I.Sp so I HFBR-2412TZ I. Fiber Optic, Receiner,STPort 9 wr.Ceramic, 10%.OlaUF, SIN 911 360 TOTAL I -sm I I____*AU06

Backplane MTRFData (3) __________________ _______ _______ _______ _______________________

172731 4 5I 6 Total Failure Rate Module ITEMNo. Part NO. Decnption Component Manufacturer MTF (Hours) Failure ate (per hour)

Assembly, ICCOSActuation Train Backplane (Cabinet Row 3) 0*0001-Assembly, ICCMS Initiation Channel Backplane (Cabinet Row 4) 0.00E+00 Assembly,ICCMSInitiation Channel Backplane (Cabinet Row 6)

RP 1 1 -5 Assembly. ICOASInitiation Cannel Backpiane (Cabinet Row 7) 0.00E+00 Assembly. ICOMSInitiation ClcannrelBackoane (Cabinet Row 8) O.00E+00 Fabrication, ICCMSActuation Traine Backplane(Cabinet Row 3) PC} I NUS-CO99N4C-2 Fabrication, ICCMSActuation Tralne Backplane 1 (Cabinet Row 4) P0 .000E001 Fabrication, ICCMSActuation Tralek Backplane2 (Cabinet Row 6) P0 NUS-CD99NC-4 I Fabrication, CCMSActuation Trait* Backplare4 (Cabinet Row 7) PCE 1 792E+0 7 NUS-CO99NC-5 i Scienltech/NUSI Idaho Falls, a lls, ID IDP 1.92E+07 Fabrication, KCXMS Actuation TrabneBackplane 5 (Cabinet Row 8) P0 14 I e nte N US IIdah o F .000E+00 565w859-5 Connector, 0DN41612Type B, Vertical, Femal, 64 pos 14 ITiEConctivit, erwynPA 7.69E+09 1.30E-09 1.82E-08 56S0819-5 Connector, DIN41612Type B, Vertical, Fermal,64 pos 7908 1.30-0 200010 8-1393640-5 Connector, DIN41612Type c/2, Vertical, Fetnal, 48 pot 72693090 1.30E-09 00.0 ____________

42819-2212 Connector, Header, 10mm, Vertical, Male, 2 pos 7.69E060 130E-09 J 1 -09 _____________

42819-221.2 Cornector. Header. 10mmoVertical. Male' 2 pos 7.69E-.0 1.30E-09 I .0DE00 I5 BP 1 23 42819-2212 Connector, Header, 0.mm"Vertical. Mate, 2 pos BP 1 29 FJH-12S-01-S-D-SM-L Connector, Header, 0."r Vertical, Mate, SMT,Locking Clip, 50 pos SP 1 30 .JH-125-01-5-0-SM-LC Connector, Header, 0.1",Vertical, Male, SMT,Locking Clip, 50 pun EIH-125-01-S-D-SM-.C Connector, Header, 0.5", Vertical, Male, SMT,Locking Clip, 50 pos Connector, Header, 0A.0" Vertical, Male. SMT0,Locking Clip,50 pot 01H-12S-01-F-D-t5A-LC EIHw12S-0tl-F--SM-LC onnector. Header. 0.05" Vertica Male. SMT. Lockine Clip SO s EJH-113-01-F-D-SM-LC :onnector, Header, 0.00", Vertical, Male, SMT, Locking Clip.26 pos 2 12 12 EJH-113-01-F-0-tM-LC ine Ch.. 26 ocs EJH-113-01"F-0-SM-LC in. Cip, 26 pos I Samtec New AIIary, IN 273-1K-RC -

I j1 i1 I 1:11: _______orWothT ticon, Fort Worth, TX 6.42E+08 273-IODK-RC Wire : 2I2AWG 1.0000 S102019K000B Vishay 1.00E+10 1.00E-10 I 0000.00 S10207501DB I 1.O000-10 LOE 1 000-I0 0 QE00 MAZ300000B 643E+06 1.56E-09 6400.08 BP 1 46 REF1028P O600E.08 ]neric Data or similar component BP 1 47 TAPIOIIK03SSCS O.OE+00 joeneric Data or similar component BP 1 48 FICK20X7RI10SK or similar comuonent BP 49 HFBR-14111 or similar component BP I so I IC,Fiber Optic, Receiver, STPort I I Ir TOTAL

Backolane MThFData (4)

Failure Rate Total Failure Rate Module ITEMNo. Part No. Decnpton

-1121314I 5-1 Component ManufactueerMTBF(Hoars) luer houri loor houriComet

I t~: ______ ___?_ 1.92E7 1.92E-07 2______

5.21E-08 5 21E-08 5.21E-06 521E-08 aP Op

!PNUS-CO99NC-5 IabL4cato, ICCMSACtation Traine Backplane 4 (Cabinet Row 7) PCB PNUS-cO99NC-6 Fab~riat[on.ICCMSActuatlon Traine Bacbplane S (Cabinet Row 8) PC OP 1 20 5650859-S Connector,DIN41612Type 9, Vertical, Fenal, 64 pos 14 1 14 1 14 1 14

! ,VertluI,Feeal,64 pos17 17 1 1 1

! c/l Vertical, Ferenal,48 pas 4 4 rEConnectioity, Berwyn, PA 7 AT I[ I MolesUsioleIL ii boles. Lisle, IL 7.69E+08 1.30E-09 O.0OE+00 oles, Lisle.,IL 7.69E006 1.31X-09 O.OE+00 iamtec.New Alny, IN 7.69E+08 1.30E-09 0.00+00 amtec,New Albny, IN 7.69E+00 1.30E-09 1.30E-09 iarntac.New Albany IN 7.69E006 1,30E-09 0.90000 BP 1 41 1 273-1000-RC SP 1 42 1 SP 1 43 1 Sj02010008 IRteoeto,Metal Ro~e,0.130.218W, 2.5PPM.19KOhim.ThroogisHole I 49e 1:1 [:F [ 1 Vishay 1 klpha Electronics Corp. 6.43E+08

90 j0 -0 OO Jerertc Data or sim2ilarcomronret 190E+07 1917E-081 0.00050 I0neric Data on similar component 3.52E+10I 2.94E-11 I O.OOE j eneric Data or similar omrponent

R*rkoion MTIF Dat I~I Rackpix" M1`RFData (5)

Module I ITEMNo. Part NO. becription Component Manufacturer MTIF f[loor) I FalurenRate ITOtW FailureRate o"e.

1 IQTY QTY 2 1QTY 3 1CITY 4 1QTY 5 i QTY 6 1W No.0 hour0 days 0 hours 0 weeks 0 months ) I pr r) 8P 1 1 CCMSActuatilo Train Backplane (Cabinet Row 3) I 1 onnelRakane(Cablnet Row 4) L LL 1

L 1

____1_1_1_ ?____ Ii

-3 jA-sln,b 1, nnel Backplane (Cabinet Rmw5) 1.92E.07 I 5.21E-0 I O.OOE+00 BP j 21 1 5658059-5 BP 22 8-1393640-5 P 2 26 4219-2211 Connector, Header, 10,r0, Vertical, Male, 2 pos I 1 1 OP 27 42819-2212 2 BP 1 28 1 42819-2212 3 MoWS, Ustei,IL Ickin Clip,50po 2L1 21 1I 12 jSamtec;NewjNbA I:

lIe,SMT, Locking Clip,50 pos 1 1I 1amtec, New AmbannIN 7.69E.W08 1.30E,.09 1.30E-09 Samtec. New Albany, IN 7.69E.08 1.3MME,-09 0.000.

3 Sarntac, New Alban*, IN 7,69Er 1305-09 0 _L__._.2 Samtec. New Albany, IN 7.69E108 1.30E-09 216 _E-09 Samtfc, New Albaan, IN 7.695E0- 1.30E-09 2.6E-09 BP 1 44 1 SP 1 45 1 BP 1 46 1 REF102BP IC,Voltage Reference, 1WV,9 PINDIP IN I TDIK,Uniondae, NY 19 JA-ao T-,. Son -an,CA I .Ra7 I R150 050 9 Awago0Tech., San Jose, CA 1,Z9E+07 I 9.17E-08 I 0.00E+OD

Oni,,.nl UTOF 5ato 161 a-k.1 MTRFDate (6)

QTY Q QTI QTY QTYI QTY MTO taiwr.sat ITol FailureRate Comsponent Manufacturer Comments Module ITEMNo. Part No. Decripton 1 2 3 4 5 6 MTF iss "Periow-h i Daerhour)

SP I 1 -1 Assembly, ICcO Actuation Train Backplane (Cabinet Row 31 1 1 ? 1.92E+07 5.21E-6 I O.OE+00 I ? _ _ __ _ I 1.LZE.07 I .216-06 ] O.000.00 I _ _ _ _ __ _ _ _ _

I 1. E+07 5.21E-08 I O.0OE0 SP 1 21 5650859-S IConnector, DIN41612Type 9, Vertical, Fena 64 pos 7 7 SP 22 48_pos 1_4 1_4_1[1: I SP 26 I I I1 I I lMoWUlesls.IL I 7.69E6.8 1 1.31X-09 1 1.WE-~09 1_2 1 1 1 1 Moles, Lisle, IL 7.69E+08 1.30E-09 I O.OE+00 3 Moles, Lisle, IL 7.69E+06 I 1.30M-09 I 00.E+00 I 7.69E+08 I .306-09 I 2.600-09 I_______________________

7.69E+08 I 1.30E-09 I 03E+00 WIne S02K1900006 SP 1 44 1 1 19.551,,,o, Metal Film,,0.1%,162/W,2.SFFM,7.50Ohom, Througil~ole I Vishay 1.30E+10 M, 30~m

_ TruhoeI

_ __ _ _ _ I I 111 1 Alpsa ElectronicstCorp. I 6.436.086 1 Texas Instlrments, Dallas,TX I 3.6$E06 I 2.72E-09 I O.0E+00 1 2.990-07 00.00E+0 2.8E-11 I O.E+O0 Ioenern Dataor similar component ME23007 0006.00Eoo ]leneri Dataor asimilatomponent 9.17E-00 I O.OE050 Ionerel Data or similar component

1T 1'2 QTYI QT 1QT6 Fd.M- 860 (pw I Total0.1..' Rate Module I ITEMNo. I Pt No. 3 4 5 6 - M -unfsr I MwUF("-I Co-met

,-I P GM 1 20 IIy*OTTII*K*Ls*I:J CIM 24 GM 1 28 1 ZVP4105A 2 1.71E09 I 5.5E-09 1.17E-08 GJM 29 rex I 4 1 . I I a~~~ 6430.0.36-0 1 .22E-09 I____________________

GIM 30 s KIon, Fort Worth, Teuas 6.420. 1.560-09. 1.25E-08 GIM j 32 M, 825 Oh- 1 2 1 1 To, Fort Worth, T-otI 6.43E.40 1.560.-09 I 3.11E-09 I GIM 33 5 Kimmr,FortWorth1,Too. 6.42E,08 I 1.56E-09 I 7.78E-09 CGM 34 22 .NA_ N/A I A GIM 1 35 F003131 IICS8PINDIPODW-oopio 7.03E+07 1.42E-08 8.54ýO0 5.47E+06 I13E-07 3.6"f-07 Ewmoonk lo Obrtd, Wo5 3WA N2- 2A 3.341E+08 2.Ml-.09 -0 930.oo.

I-, P.- TX1 2 3.4E+07 I 2600-05 5.750,,5

_ _ _ _ I__ I__I_ _II__I_ 2i8.436 I M0 I C-'S" I!1Tf.'M fthb[~N-l

$ WMT~too M." tkaI

ContactOutput Modul~eMTSFData Failure Note Total Fail-e Rate Module I rTEMNo. I Pat No. I Detrption Component Manufacturer MTBF(H-om) C-enemtin QTY~

I1 I QTY I 1Q 1QT0 OT IQ10 (per hour) (per hour)

I dentech/NUSIIdaho Fals 0 1,92E407 Flao.II N/A 3.52E÷10 S84E-11 I 5.6E-11 3.52E+10 2.19E+07 COM 1 20 1 11R154C IInductor, 10%, 150UH LFla.-ed N/A wed,Flamed 4 VCCIn.CSanMarco., CA WA N/A 7,9E+09 1.30E-09 I 1.301E09 MOM 1 27 1 ZN70DO INCh.nn.1FET.T092, 6OV,200MnA COM 1 31 1 RNCSSH82S0*

COM 32 RNCSSH2201FS COM 33 TP-205-01-00 rent Point, Breakaway, Back 21

!Earn ýfl5p.,leDoIleNJ N/A NA N/A COM 34 FOD3181 Fm;itSennlrnductor, anIos 7.03E07 1.42EW 8.54E'0 COM 35 NF2EB-12V 4.9&E.07 2.01E-01 I 04E-08 IPanord Ee.eor* Work,, OmaN.

COM 36 HEF401068P COM 37 AQY2126H Doemnot contribute to the failure rate of the ICCMW COM 38 RS-2405D TOTAL I O.72m I I I.171-08 IAVAILAMILMforle Mekdal

1 I 11111041 1 WMOOW*

M1 Urn 17 4

I lMTll for Modulemiu,

.60 JMLDTfo- Moduleminutes TOTAL 0.9M578 iISE-0S AVAILABILITY for Module

01001.1Select Modlel MIOF Data QTY'QTYIQTY QTY QTY Failure Rate TotI1 FailuleRot.

Modul. I rEM No. Part No. Drcptkion I 2 3 CormporerrtManfacturero MPTSY(Hours) Comeunts 4QT 5 6 (per hoer) (per hour)

DSM 1 OSM 1 6

7 1

1 NUS-A332NB-1 MUS-COOSPA-1

_________I IIEI II Srdontad,/NUSl Idho Falls,10 Scdented,/NUSI Moao Fall, ID TDC Uniondale, NY TOO.Uinxiodl. NW DSM 1 19 1 FK2207R1H33SK jC.Pedto, Cerninic.1054,3.30, 906 MIN 6 TDE.Unioncdole, NY 3.52E+10 1 2.54E-11 1.706-10 7.96E-09 I 4.78E-08

!VA . fA Ioee rot contrrlnt. to Mhefalure raft of te ICCM5 N/A j N/A Ifes ret contrbute to the failure rate of the ICCMS 1.306-09 [ 1.3O6-09 DSM 1 26 1 53047-03 1 7.69E60 I 1.30E-09 1.30E-09 270-1SK-RC Resistor, Metal Film, 1%, 1/8W,IUDfl 6 Xikn, Fort Worth, Tons0 6.42E+08 I 1.56E-09 I 9.34E-09 Y4053SKOOOQ)OL 1 Vihey Proelion roup, t PA DSM 1 31 1 270-1K-RC 1 Mcoon,Fort Worth, Texas 3 Xicon,Fort Worth, Texas r.*n,Fort Worth, Texas DSM 1 34 1 RNCSSM8250FS 3 Moon,Fort Worth, Texas 6.43E+08 I 1.56E-09 4.67E-09 2 VKNWPresionDroup, Wo 2.06E-10 ikC-, Fort Worth, Texas 1.56E-09 Xicon,Fort Worth, Texas 1.56E-09 DSM 1 39 1 270-4.99K-RC IRejoste,Metal Fill, 1%, 1/11W,4.996.1 1 Xi0n, Fort Worth, Tens 6.42E+08 I 1.56E-O9 1.56E-09 1

29 2

DIM 1 44 1 FOD3181 IX. 8 FINDIPOortso~oleor I Fairchil tornlommidedor, SanJoan,CA I 7.03E.07 I 1.42E408 I 4.276-06 1

Te.as h'ts-n'-ts, Dalefr,TX 3.71E+08 1 2.70m-09 2.70E-09 1 I 3.63E030 I 2.726-09 I 2.726-09 DIM 49 1 LT1O140MWF 1 7.14E0.9 I 140E-10 1 1.40E-10 I)M I 1 DSM 1 1

1 1

I i lRecomn,Blrookifn, WC 1.400.06 I 7.1E-07 I 7.11E-07 IGeric Dateor skrmilarcoorponent

Difference Modol. MTBF Data Total Failure Module ITEM No. Part No. Deaiptlon ON I WY 2V 3YI TY I Q57jQ6Ty Component Manufacturer MSF (Hours) Rate o( per hour )

J SM SM DM j

1 6

7 12 1FK27XTR1H104K :apaoltor, Cerantic,10%,OlouF.50V

apaoito, Ceraftc, 10%, 1..F,X711LS(

_________1~LE~EIFE~ 17 TM0 Uniondale,NY TO0,Uniondale,NY

________~

___N/A 1.92E07 3.52E÷10 5.21E08

__ N/A__

__

2.i4E-11 I 5.21E-06 NA 4.93E-10

a , arntcIM 3u F, 7R TOO,Unonodale,NY DM 1 16 1FK22YSVIE226Z ,ap00Itw. Cerantic,20%,22uF,25V 1 TDVK Uniondale,NW 3.52E÷10 2.84E-11 I 2.14E-11 DM 1 19 53047-03 I THRU-HOLE I2 I 1.30E-09 I 2.60E-09 DM 1 24 1270-2.2K-RtC OPM, 2.22k, Thru-hol. 1 Xhkon,Fort Worth, Teo. I 6.42E+08 I 1.56E-09 I 1.56-%9 0PPM.2.49k*" Thru-hole Xicot, Fort Worth, Tees 6.42E0.08 I 1.56E-09 1.56E-09 OM 1 28 I270-9.1K-1C 4 6.42E+06 I 1.56E-09 I 6.23E-09 7

DM 1 31 1270-4.02K-RC 4 Xk1on,Fort Worth, Teoas I 6.43E+09 I 1.56E-09 I 6.23E-09 1

DM 1 36 1Y405351C00000J0L IRsistor, Variaeole. Sr, O.SW, 25 TURN,THROUGHHOLE 1 1.00+10 I 1.00E-10 I 1.00E-10 DM 1 41 ITP-105-01-0 ITESTPOINT,BREAKAWAY,LACK( 17 N/A I N/A I N/A . ICCMS SM 1 44 JOPA277P IIC-OPAMP, GP,[REC 1MZ. SGL, 8 PINDIP TeamsInstruments, Oallim, TX I 3.6E.-08 I 2.72E-09 I 2.72E-09 2

DM 1 48 AlR N/A 1.00E08 I 1.00E-0 I 1.00E-08 DM 1 50 ILT1013CNB#PBF C, OPAMP, DSal Precison 2 inea. Tedi 7.14E+09 1.40E-10 I 2.30E-10 S

MO Total r. 1 1 2. -S L7" AVAIULMUI" foiMdlem

QTY CTY QTY QOV CITY QTY Failure Rate Total Failure Rate FGM 7 NUS-A327NB-1 Fabrimation, Contlct Output PCBoard 1 1 1 1 1 1 Scientoch/NUSI Idaho Fela 10 1.92E.07 5.21E-08 5.21E-0O FGM 8 NUS-C0PA-1 Assembly, FuPncon Generator Face Plate, SORT(-1) 1 0 0 0 0 0 Sientech/NUSI Idaho Faoo ID N/A N/A N/A Does not contribute to the failure rate of the ICCMS FGM 9 NUS-COWPA-2 Aassenbly,Function Generator Face Plate, HPIF (-2) 0 1 0 0 0 0 SdentectNUSI Idaho Faols,It N/A N/A N/A Doe. not cootrlbate to the flilure rate of the ICCMS FGM 10 NUS-COMPA-3 Assenbly, Functon Generator Face Plate, TSATsct (-3) 0 0 1 0 0 0 Scientech/NUSI Idaho Fal ID N/A N/A N/A Does not contribute to the failure rate of the ICCMS FGM 11 NUS-COSOPA-4 As.amtbly, Function Generator Face Plate, TSAYsh.nan (-4) 0 0 0 1 0 0 Scientech/NUSIIdaho Falls, I0 N/A N/A N/A 0oes not cotntibote to the failure rate of the ICCMS FGM 12 NUS-COSOPA-5 Asemnbly. Function Generotor Face Plate, TSATsh.err (-5) 0 0 0 0 1 0 Scientach/NUSI Idaho Falls, ID N/A N/A N/A Does not contribute to the failure rate of the ICCMS FGM 13 NUS-COBOPA-6 Asemnbly, Functron Generator Face Plate (-4) 0 0 0 0 0 1 cie.ntoch/NUS1Idaho Folk, ID N/A N/A N/A Does oat ceolibute to the failure rate of the ICCMS FOM 14 08OSSC473KAT2Q Capacitor, Creraic, 47uF, SOYV,T7, 10%,080MSMD 1 1 1 1 1 1 AVXCorp., Foautain Inn, SC 3.52E+10 2.84E-11 2.34E-11 FGM i5 TLCR1O5MO35RTA Capacitor. Tantalum, luF, 35V,20%, 085 SMD 2 4 4 4 4 4 AVXCorp., Foataoin Inn, SC 3.35E+06 2.99E-07 5.97E-07 2 of 4 contrlbulte FGM 16 T491A106K016AT lCapacitor.

Tantalnum,100F, 1iV, 10%, SMO, Case Sze A 1 1 1 1 1 1 Ken.t Corporationi, Greenville, SC 1.82E.05 5.48E-06 5.48E-06 FGM 17 08065C104K4T2AICapacitro, Ceramic,0.100, 50V, X70, 10%,08M SMID 161 10 161 161 161 16 AVXCorp., FountainInn, SC 3.52E110 2.84E-11 4.SSE-10 18 19 20 COSSC33MGACTU 1 1 1 1 1 1 12 ~met Corporation, Greeooile..SC 2.65E+09 3.77E-10 3.77E-10

-SI U FGM 22 FOM 23 FGM 24 FGM 25 11R143C Inductor Radial, ISOUN0.35A 2 2 2 2 2 2 IMurata Power Solotions, Mansfield, MA 1.26E+60 7.96E609 1.59E-08 FGM 26 11R104C Inoductor Radil, 100UH0.35A 2 2 2 2 2 1 2 IMurata Power Solutiomn Mansfied, MA 1.26E+OB 7.96E-09 FGM 27 FIGM FGM 38 REF1028U IC +OYVPRECREFERENCE 8-SOIC 1 1 1 1 1 1 Texas lnstruents. Dallas. 15 T3.M1[o+08 I 2.726-09 2.72E-09 FGRM 3 OPA277UA *"2 2 2 2 2 2 2N 1 1 1 1 1 1 FGM 40 53047-0310 7,69E+08 1.30E-09 1.30E-09 FGM 41 y4053500ROW0J ITdmirarer R*"noro - Multi Turn 124OW 600 OHM 5.0% 4 4 4 4 4 4 IVihv/Dale Matron, PA 1.00E+10 1.00E-10 4.006-10 Generic Data or itniler component 1.56E-09 FGM 46 288-0805-3 47 48 16 1 16 1 16 1 16 IPwaoknt,Secaucus, NJ 5.88E+16 1.70[-17 2.72E-16 49 50 FRM 51 RG2012N-142-W-T1 jRES 1.36 OHM 18W .0% 0806 SMO I 1 1 1 ISu--m, Palisades Park, mJ 1.09E+09 9.176-10 9.176-10 FRM 52 1 1 1 1 2 1 FRM 53 1 1 r-M 54 EPA-6AEB202V 1RES2.0KOHM IBW .1%0GM SMD 2 2 2 2 2 [Panaor.c, Secaocus, NJ 3.33E+11 3.006-12 I 6.006-12 FGM 2 2 IGM 1 1 1 1 1 FGM 57 CRCW08052149FKEA RES2.49K OHM 1/8W 1% 0805 SMD 1 1 1 1 I 1 I*Shay/DaleMalern, PA 1,00.+10 1.00E-10 1.006-10

FGM 61 0040/111 CONNECTOR, TESTJACK,FEMALE2 ROW RIGHTANGLETHRD-HOLE 2 2 2 2 2 2 Schurler, SantaRosa,CA N/A N/A N/A Does not contribute to the failure rate of the ICCM5 FGM 62 TP-10S-01-00 TESTPOINT,BREAKWAY, BLACK is 1s is is is is Components Corp., Denville, NJ N/A N/A N/A Does not contribute to the failure rate of the ICCMS FGM 63 90120-0122 CONN HEADER2POS 0.100" STRTIN 1 1 1 1 1 1 Molex Inc., Lisle, IL 7.69E+08 1.30E-O9 130E-09 FGM 64 N1US-CIOOPA-1 PROM PROGRAMMING,SQRT,PROGRAMMEDINTOPARTAND THEN 1 Scientech/NUSI Idaho Fails, ID 1,64E+06 6.11E-07 6.11E-D7 Atmel AT27CIO24-70JU FGM 65 NUS-CiSOPA-2 IROM PROGRAMMING,HPIF, PROGRAMMEDINTOPARTAND THEN I Scientech/NUSI Idaho Falls,ID 1.64E+06 6.11E-D7 O.OOE+0 AtRmelAT27C1024-70JU FGM 66 NUS-CiOOPA-3 PROMPROGRAMMING,TSAT(NOM),PROGRAMMEDINTOPART AND I Scientech/NUSI Idaho Falls,ID 1.64E+06 6.11E-07 O.OOE+OD Atmel AT27CIO24-70JU FGM 67 NUS-CiDDPA-4 PROMPROGRAMMING,TSAT(-ERRJ.nom,PROGRAMMEDINTOPART AND I Scientech/NUSI Idaho Falls,ID 1.64E+06 6.22E-07 O.OOE+00 Atmel AT27CSD24-70JU FGM 68 NUS-C1SDPA-S P ROM PROGRAMMING,TSAT(+ERR).err,PROGRAMMEDINTOPARTAND I Scientech/NUSI Idaho Falls,ID 1.64E+06 6.11E-07 O.SOE+00 AtrelIAT27C1024-70JU PROMPROGRAMMING,Future needs, PROGRAMMEDINTOPARTAND 6.11E-07 OD.OEDOD FGM 69 NUSI-CSDPA-6 THENMARKEDON PART I Scientech/NUSI Idaho Falls,ID 1.64E+D6 Atmel AT27CID24-70JU FGM 70 AR bumper Wire, 24 AWG, KYNAR I I I 1 1 1 N/A S.ORE+08 1.ODE-O8 1SORE-O8 Generic Data or similar component 5.17E+04 1.66EO5 1.93E-O5 MTBF for Module (hours)

S MTIR for Module (minutes) 360 MLDTfor Module (minutes)

Total 0.999882 1.A8E04 AVAILABILITY for Module

________________FRIer Modnin MM Data QTY QTY 018 018 ATY OlY Mlodolo fM5 No. PortNo. De-"-oo1 3 4 5 6 Cpon*nt Manufadhoer Took3 NwA.obn Too*3 Fa&k-n T.*k 3 F.0-n Moto n~ot FM 5 MU5-A342N6-l Fobn~~~rk F*WOPCBo I Sd-.ntoh/USI WO.t F~.k ID 1.92E.07 S.16-09 S.21E-08 _________________

FfA 7 NUS-CI22PA-1 A-Mnoky, Book Fon Pkwt I Sdotd,/NUSI MottoFokt I) N/A N/A */A notnoo Dosroot utrleto rho foth.. raft of Ore.KXMS FM 11 S3047-031 Coonnector,54013 PO3.1.25rr0. vertkallloo-ttole I ____, __ A let itiI 7.696000 1w30609 1366-09 ____________________

FM 12 536395-S Coonooor, DIN41612M 64 POt2.54 enonSokldoRWMh AngleThruRole I IT CwnKWtt.IV,Mtwy., PA 7.636.0 1.30E-09 1.3m609 _ _________________

____ _________5.7E016 516646 iM-lm 54736for Modul1...)o~f

____ __________ SWMTR for ModuloIrrnskmaw

____ ___ _________368 E.0Tfsr Mdlo (.01.8..)w To~ OUI6 1M02-06 .. VARAINUf WoMadd

Power SupplyMo4to ModuleMT9F Data 77 1 TT1111I I T r T F.ueR.ITotal FWWor QTY QTY OTY QTY OTY CITY Module ITEMNo. I Pat No. Co dponent Manufaturer MTSF( Hu.)o Cooret (p.t hour) IpnRaen 1 1 2 1 3 1 4 1 S 1 6 PSMM 1 6 1 NUS-A3211N-1 Scd-tech/NUSI daho Folk.ID 1.92E407 Soo.tot"hNUSI MdahoFalls,ID Rotom,B f NY 1.40E+06 "DE. Unlood~o. NY 3.52E.10 PMINM 1 15 1 FK22X791)43316lCondoritCoook ww.i Ot, 3.3oU, 5 0I 3IS2EolO

~I II IEIEIEIEIE TOE, TOE.Unloonh.,

Unroool. NYNY 3.S20*1 2A4M-11 2.ME-11 4 2J4E-11 1.14E-10 2 TDK,Uniondole,NY 2.4Em-11 5.62E-11 ASSCorp., FoontolnIon. SC 2.9Km-O7 Diodes InC.,Podlno."i 4.966-09 FoirediMSamkducoltwr San Jose,CA 5.1OE-'09 M-klo Po-.. Solulion., MaonIed. MlA N/A N/A INo/ARIrme,CA N/A 1.3416-0 1.30E-09 FaondrildSermleoductor Son JWo.e CA 1.02E-10 6.4OE-0$

6466-09

=1Foot WoJtseTo. 3.06E-09 51.0n.Fort Worth,Tesmo 3.11E-09 Vi.on, PForW ot,.Tex nP 2.00E-10 m10. moo960.1, Too.

PSMM 1 41 1 270-W-RC I-RESISTOR, METALFILM,1%,111111,I= 3 1.56E-09 I 1.40E4-PSMM 1 54 1 LT4350IDE-10PIF LTI P9MM 1 59 gmii PSMM 1 T ;;60 1 AQ.Y2120H IC,PHOTORELAY,4 PINDIP I

Reactor Trip Module MTBF Data Total Failure QDfvTYQTY QTY QTT QTY FliueRate Module ITEMNo. Part No. Dec PEonQ 1 2 3 4 6 Corntponent Manufacturer MTBF (Nour) F(per hour) Rate Conmments (per hour)

RTM 6 NUS-A330NB-1 Fabrication, Reactor Trip PC Board 1 Sc:artech/NUSI Idaho Falls, ID 1.92E,07 5.21E-06 5.21E-O8 RTM 7 NUS-C0B3PA-1 Assermby, Reactor Tripr Face Plate 1 SciateWhrNUSI Idaho Fails, ID N/A N/A N/A Does not contribate to the failure rate of the iCCMS RTM 11 F-i2WTRIH225K Capacitor, Ceramic, 10%, 2.2uF, X7k, 2SV 2 TDC,Unlondale, NY 3.52E+10 2.U4E-11 5.69E-12 ATM 12 FK2207R1.H33SK Capacitor, Ceramic, 10%, 3.3uF, SOV 4 TDk,Uniondale, NY 3.52E.10 2.84E-U 1.14E-10 RTM 13 FI2SX7RIH104K Capacitor, Ceramic, 10%, OluF, 50V S T1K,Uniondale, NY 352E.10 2.84E-11 1.42E-10 RTM 14 11R1S4C Inductor, 10%, 1S0uH 4 Murala Power Solutions, Mansfield, MA 1.26E+B0 7.96E-09 3.11IE-011 RTI 15 S3631S-5 Conn DIN41612 M 64 POS2.S4mm, Solder Right Angle Thru-hole 1 TEConnectivilY, Berwyn, PA 7.69E+01 1.30E-09 1.300-09 RTM t16 53047-0310 CONNECTOP,MALE3 POS,2.-4MM, VERTICAL TH RU-HOLE 1 Moles Ic., Lise, IL N/A N/A N/A Does not contribute to the failure rate of the ICCMS Iof 2 does not co tribute RTM is 2N7000 _ 1440 wel MOSFET,T092,T60V,20DmA 8 FairchildSemiodtor, San Jose, CA 1.AIE+07 6.OE-Ii T.12ETd7 RTM 19 IZVP410SA P-Channel MCOSFET, TO92,5OV, 17S.A 7 Diodes Inc., Palnm,TX 1.71E+06 SAS*E-09 4.10E-00_

RTMV 20 RNCS5H1502FS RESISTOR,METALFILM,1%, 119WV,15kn l jXicon, Fort Worth, Texas 6.42E+O$ 1.56E-09 1625E-08 RTM 21 *INCSSH20WIFS RESISTOR, METALFILM,1%, 1111W,2kn 14 Xtcon, Fort Worth, Texam 6.421+09 1.56E-09 2.1RE-08 RTM 22 RNCS5HMO5FS RESISTOR, METALFILM,1%, 1/81825 1M Xicont Fort Worth, Tuna 6.43[409 1.56E-09 1.56E-09 RTM 23 TP-105-01-00 TESTPOINT,BREAKAWAY, BLACK 1 Compornents Corp., Demmile,NJ N/A N/A _ NA Does not contribpute,to the failure rate of the ICOMS RTM 24 C*D471SIE QUAD2-INPUTOR GATE,14-DIP I Texas Instrumtents, Dallas, TX 3.71E40N 2.70E-09 2.70E-09 RTM 25 CD400)IBE QUAD2-INPUTNORGAIL 14-DIP I T-as Intrumets, On~s, Tx N/A N/A N/A Does not contribute to the faidure rate of the ICCMS ATM 26 CM472BE DUAL4-4NPUTOR GATE,14-DIP I Texas instrumnents, Defies, T)( 371E+GN 2.70E-09 2.70E-09 RTM 27 FOD3181 IC,8 PIN DIPOptocouplr 4 Fairchild Semiconductor, Son Jose, CA 7.03E+07 1.42E-09 5.69E-0M Generic Data or similar component RTM 28 A.QY212GH IC,PHOTO RELAY, NORMALLYOPEN.4 PIN DIP I Pelsnwk Electra: Worits, Osaka, Japan N/A N/A N/A Does not contribute to the failure rate of the IOCMS ATM 29 PCH175 LEDHOLDER,Snu, SINGLELEVEL 3 VOCInc., San Marcos, CA N/A N/A N/A Does not contribute to the failure raft of the IOCMS RTM 30 WP57EGW LED,S-m, BI*OLOR, RED/GREEN 7 - -WBright, K City of Industry, CA N/A N/A N/A Does not tontribute to the failure rafte of the kICOMS ATM 31 H-27SC-2 LIEDHOLDERS-ar, DUALLEVEL 2 SINARIrvine, CA N/A N/A N/A Does not contribute to the failure rate of the ICCMS AT*M 32 RNCSSH2201FS RESISTOR,METALFILM,1%, 119W, 2.20 1 Xi..", Fort Worth, Taeas 6.42E408 1.56E-09 1.56E-D9 RTM 33 RS-240OD DC/O* Converter, 2W, 24 VDCInput, 4/-5 VDCOutput I Recown,Br'ookiyn, NY 1.40E+06 7.15E-07 7.1SE-07 Genric Data or similar component I4.6i40 11.77E-07 2. 171E-06 MTS for Module (hours zMLDT fo~rMohdue (mhoamtes)

Stmmer Modole MTBFData Total Failure QTY QTITY IQTY QT QTOIO Failure Nate Module I TEM No. I Part No. Decnrpton 1 2 3 4 5 6 Component Marufacturer I ME (Honrs)

(per hour)

Rate Comments (per howr) oard Sdientech/NUSI Idaho Falls,ID) I 1.9ZE.07 I 5.21E-OR I 5.2E-08 ate o0s not contribhte to the failurerate of the ICCMI SM 1 13 11R154C 4 M-r8la Power Sehtiors, Mansfield, MA fen RightAngle rshru -r'oren.

PA tTICALTHRU-HOLE 7.69E+Eg I 1.30E-09 I 2.60E-O9 ff-5W, 21 TURN,THROUG SM 22 Y405310KODOM RN,THROUGHHOLE SM 23 Y40532KOMOL 1, THROUGHHOLE SM 24 270-2.2K-NC M, 2.2k1.Thra-hole I Xkon, Fort Worth, Texas SM 25 270-249K-RC M, 249kR.Thro-hole Xit*n, Fort Worth, Texas SM 26 2170-15K-RC or, 1ISO,Thoulh-hole Xtcon, Fort Worth, To., 6.42EtO8 I 1.5EE-09 I 6.23E-09 SM 27 WIRE,22AWG,BARE 22AWG SM 2B 270-9.1K-RC M, 9.1kE, Thrl-hole Elcon,Fort Worth, Texas SM 29 270-10(-RC M, EOkn.Tmru-hole XElon,Fort Worth, Tenas SM 30 270-47,SK-RC M, 47.5k.a, Thfu-hole Xlo*n.Fort Worth. Texas SM 31 270-4.02K-RC M, 4b2kf, Thru-hole 4 Won,Fort Worth, Temas E43E+aO 6.43E440 6.42E+nO 1.56E-O9 I 7,79E-09 SM 36 SM 37 SM 38 12704.99K-RC 4 I

5 Schurler, Santa Rosa,CA I N/A I N/A I N/A boonnot contribute to the failum rate of the ICCMS 17 Does not contribute to the failure rate of the ICCMS 3-nerc Data or NIAP' 2 L?"- not con N/A N/A jToes not contr Bourns, Rheride, CA 8.76E+10 1.14E-11 1.14E-11 39

)9 SM 1 49 360 MWDTNfrM~dW*i. Itrros Tow0 I _____[I 227-M- AVAISM MdoI har

Train Trip Module MTBFData Totrl Falure Foilue Nate Rate Module I ITEMNo. PartNo. Decripbon Comnponent Manufactulrer MTSF(Ho-rs) Comnents (prha) (per hoor) 17 27 3 4 tion. PCBoard ________________ 1 1 :1i : t ! ,Icintch/NUSIIdahof.M.. ID 1 1.92E.07 5.160 _ ___

Iv. HIAuctioneer Face Plate, SQRT I clntehr/NUSI Idaho Faks, I0 e ,, b , NY N/A I. 4OE06.0 J 7.,E3.0777 N/A - N/A 7.15E-07 6 r, Unlondale, NY 3.52E.10 2.34E-11 1.70E-10 TTM 17 TrM 18 TrM 19 1 FK28X7R1H1O3K Capacilor, Ceranic, 1 1 MOR, Unlondale, NY TDK,Uniondale, NY TIM ak*hdld Serni-ductor, San Jose, CA E-08 1 4.57E-0 TrM 22 lomb Porer Solutions, Maosfield, MI TTM 25 ICC Inc.,San Marco-, CA TTM 26 T-1 3/4, Oiffosed, Fl.agltss 6 ICCIn., San Marcno, CA N/A *A N/A rTM 27 JAL LEVEL WAR Irvim, CA N/A N/A N/A POS. 2.54MM,Right Angle, Through T Connectiity, Berwyn, PA 7.6961D01 L30DE-09 1.30E-09 POS,1.25MM, VERTICAL THRU-HOLE I Aoule Inc, Lsle, IL 7.69E.*09 1.30E-09 2.30E..09 ft0 Inc., Lisle,IL 140om,&ooklvno NY lWa Me,tan Jose,CA 5 (icon, Fort Worth, Toams i.43Et40 TTM 1 36 1 RNCS5HI201FS IResistor,Metal Films,1%,1/11W,L.kOhrn 4 (cmn, Foat Worth, Takes 6.42E.E01 Ucon,Fort Worth, Texas 6.42E60 I L6Et-OP I 1.56E-09 TTM 39 (Icon,Fort Worth, Teoas TT 1 40 1 (Icon, Fort Worth, Temas TI'M 41 Resistor, Metal Film, 1%,11/1W,3.gkOhr 12 (con, Fort Worth, Texas 3 (icon, Fort Worth. Texas 37 (ion, Fort Worth, Tones 1.S-09 I 1.56U0-cOwn,FortWorth, Tnexs AK Comaponents,Newton, United Stal TrM 1 46 1 TP-lO-01-OD ITEST POINT,BREAIAWAY, SLACK :oeponents Corp., Denavl..,NJ 471 :mirhildSericonductor, tan lose,CA TTM 47 XP Sem*mconductors, Netherlands TrM so FexaslenrtumenntsDallas,"TX TIM 1 51 1 LP,655CN lID I :.AdSdlernicn*ductor, Ste Jone, CA ream Inustrenlets, Dels, TIX reamsbusrtrunneft Dallas,IX 2.70EVO9 remasInst-ents, Dallas,TX

'anasonicElectric Woaf Osaka,(apet Iolen c, lisle, IL 1,30E-09 2160A-09 TTM 1 60 1 AR 1WIRE.INSULATED 6O0VOS GRIEATER, TYPEB ORC.26AWG,COLORAS REQUIRED 1 sIlll-W*it750 1.08E15O 1.0KE-OS I 1.084E-01 1 N/A I N/A 1

2.3RE-02 1

2.28E-08 1

T"I1M 67 1 AR Wire r*

7 L,131.09 I 2,11i-f I 4ASMi,0 NIMYFI

v t e Letter Sequence Other
TAC:ME6527, (Withdrawn, Closed)
Initiation Request, Request, Request, Request, Request, Request, Request, Request, Request, Request, Request Acceptance... Supplement, Supplement, Supplement, Supplement, Supplement, Supplement Administration Questions 7 December 2011 8 February 2012 2 March 2012 4 May 2012 1 August 2012 5 July 2012 5 July 2012 17 July 2012 2 August 2012 3 August 2012 16 August 2012 28 August 2012 30 August 2012 19 December 2012 10 January 2013 1 February 2013 Answers 5 January 2012 19 January 2012 22 March 2012 4 April 2012 16 April 2012 12 April 2012 26 April 2012 18 June 2012 18 August 2011 11 August 2011 25 August 2011 11 August 2011 21 August 2012 15 December 2011 15 December 2011 21 December 2011 11 October 2011 19 January 2012 5 January 2012 6 September 2012 Results Withdrawal Other: 3F0112-11, Corrections to the Extended Power Uprate LAR 309 Vendor Affidavit and Technical Report, 3F0113-08, Attachment D: ANP-3195(NP), Revision 0, Response for Crystal River Unit 3, EPU Licensing Amendment Report NRC Reactor Systems Branch Requests for Additional Information (Non-Proprietary) and Attachment E: Location of Reactor Systems RAI Re, 3F0712-03, Attachment E to 3F0712-03, Technical Report, ANP-3052, Rev. 2, CR-3 EPU Feedwater Line Break Analysis with Failure of First Safety Grade Trip., 3F0912-01, ANP-3156 Np, Crystal River 3 EPU Boric Acid Precipitation RAI Responses, Attachment C, 3F1011-08, ANP-3052, Rev. 0, CR-3 EPU Feedwater Line Break Analysis with Failure of First Safety Grade Trip, 3F1112-02, 17877-0001-100, Rev. 1, CR-3 Inadequate Core Cooling Mitigation System Reliability Assessment, Task 1, Page 174 of 250 Through Page 250 of 250, ML11259A012, ML11300A226, ML11342A195, ML12031A032, ML12053A231, ML12107A068, ML12202A734, ML12205A357, ML12205A358, ML12240A119, ML12255A409, ML12262A385, ML12314A391, ML12314A392, ML12314A393, ML13032A540
MONTHYEAR2012-03-26 [Table View]

ML12314A392

Text

8.0 REFERENCES

SUMMARY

1.0 INTRODUCTION

7.0 CONCLUSION

8.0 REFERENCES

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