ML23113A017
| ML23113A017 | |
| Person / Time | |
|---|---|
| Site: | Holtec |
| Issue date: | 04/17/2023 |
| From: | Storage and Transportation Licensing Branch |
| To: | Holtec |
| Shared Package | |
| ML23113A015 | List: |
| References | |
| Download: ML23113A017 (1) | |
Text
Summary of phone call with Holtec International (Holtec) on April 17, 2023, regarding request for additional information (RAI) on Holtecs application for HI-STORM 100 Amendment No. 18:
RAI discussed below:
RAI 6-1 requested information to evaluate the shielding implications of documented alternate decay heat load patterns and to submit details for those updated patterns or provide a generic shielding methodology for evaluation of any developed alternate decay heat loading patterns.
Clarifications:
Holtec indicated that shielding methodology was changed in Amd 16 (which is still under U.S. Nuclear Regulatory Commission {NRC} review), and that burnup, enrichment, and cooling times (BECTs) are no longer linked to the decay heat limits. Therefore, Holtec indicates that the thermal topical report (TR) has no impact to shielding in Amd 18, because shielding is not changing from Amd 16 to Amd 18. If the systems are approved in Amd 16, then those same systems and limits would remain unchanged in Amd 18.
The NRC staff indicated that A16 is currently under NRC review, and that Holtecs approach has not been approved to date.
Holtec will clarify the link between Amd 16 to Amd 18 in their response to RAI 6-1.